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열저항과 K-factor를 이용한 LED 조명광원의 정션온도 예측기법에 관한 연구
이호운(Ho-Woon Lee),조영진(Young-Jin cho),곽계달(Kae-Dal Kwack) 대한기계학회 2009 대한기계학회 춘추학술대회 Vol.2009 No.11
It is difficult to determine the maximum and partial junction temperature simultaneously because LED lightings are manufactured using several chips with low power rather than single chip with high power. In this study, in case of the lighting source module of the MR16 assembled lots of the LED, the method determining the maximum and partial junction temperature simultaneously with LED and simply applying to the industrial site was deduced. At this end, by using the transient measuring technique, the thermal resistance of an one-chip was analyzed in detail and the thermal resistance of the whole module was calculated by applying to the K-factor calculation method. Comparing to these techniques, thermal network techniques, by using conduction and convection thermal resistance, which can estimate the maximum and partial junction temperature of the LED chip simultaneously in which it is adhered to a module by applying the MR16 optical source module to the thermal resistance was propose.
디스플레이용 LED 패키지의 열전도성 변화에 따른 열특성 분석
정민우(Min Woo Jeong),허재혁(Jaehyeok Heo),강훈(Hoon Kang),서태원(Tae Won Seo),김용찬(Yongchan Kim) 대한기계학회 2011 대한기계학회 춘추학술대회 Vol.2011 No.5
LED는 에너지절약적이며, 친환경적이고, 긴 수명을 갖는 매우 강력한 광원이다. 최근 LED는 여러 산업분야에서 적용되고 있으며, 고집적화 및 고출력화되는 경향에 따라 패키지 방열특성의 중요성이 높아지고 있다. 특히 LED 정션에서 발생하는 열은 LED 칩의 신뢰성과 효율에 중요한 영향을 미치기 때문에, LED 패키지는 열적인 문제를 고려하여 설계하여야 한다. 본 논문에서는 디스플레이용 LED의 열적 특성을 전산해석을 이용하여 분석하였고, 패키지 구성 물질의 열전도도 변화에 따른 열특성 개선효과를 고찰하였다. 해석결과에 따르면 die attachment를 위한 paste 부분이 열전달 경로상에서 가장 취약한 것으로 밝혀졌으며, paste 부분의 열전도도 향상에 따라 LED 패키지의 열적 특성은 4.6℃ (8.8%)정도 향상되었다. LED (Light emitting diode) is a powerful lighting source which has several advantages such as high energy efficiency, long life, and eco-friendliness. Recently, LED has been applied to various industrial fields, and the importance of thermal dissipation is increasing due to high power and integration tendency in a LED package. The thermal characteristic of the LED package should be carefully considered in the design process because the heat generated from junction degrades reliability and efficiency of LED. In this study, the thermal dissipation of a top view type LED package for display was numerically analyzed with a variation of thermal conductivity of package material. Thermal resistance was the highest in the paste used for die attachment, and the chip temperature decreased by maximum 4.6℃ (8.8%) with an increase in thermal conductivity of the paste.