Failure Mechanism of Pb-Bearing and Pb-Free Solder Joints under High-Speed Shear Loading

김종웅,정승부 대한금속·재료학회 2010 METALS AND MATERIALS International Vol.16 No.1

The failure behaviors of ball grid array (BGA) solder ball joints under the various loading speeds of the high-speed shear test were investigated both experimentally and with non-linear, 3-dimensional finite element modeling. Conventional Sn-37Pb and Pb-free, Sn-3.5Ag solder alloys were used to compare the failure behaviors. Far greater shear forces were measured by the high-speed shear test than by the low-speed shear test. The shear force further increased with increasing shear speed, mainly due to the high strain-rate sensitivity of the solder alloys. Brittle interfacial fractures were more easily achieved by the high-speed shear test in the Sn-3.5Ag solder joints, especially at higher shear speed. This result was discussed in terms of the relationship between the strain-rate of the solder alloy, the work-hardening effect, and the resulting stress concentration in the interfacial regions. However, no transition of the failure mode was observed in the high-speed shear test of the Sn-37Pb solder joints.

Sn-3.0wt.%Ag-0.5wt.%Cu 솔더 볼 접합부의 고속전단 특성

이영곤 ( Young Gon Lee ),이희열 ( Hee Yul Lee ),문정탁 ( Jeong Tak Moon ),박재현 ( Jai Hyun Park ),한신식 ( Shin Sik Han ),정재필 ( Jae Pil Jung ) 대한금속·재료학회 2009 대한금속·재료학회지 Vol.47 No.9

The effects of shear speed and tip height on the high speed shear test of Sn-3.0wt.%Ag-0.5wt.%Cu ball joints were investigated. Solder balls of 450 μm in diameter were reflowed at 245℃ on a FR4 PCB (Printed Circuit Board) in order to obtain a sample for the high-speed shear test. The UBM was comprised of Cu/Ni/Au, and the shear speed and tip height varied from 0.5 to 3.0 m/s, and from 10 to 135 μm, respectively. According to the experimental results, faster shear speed enhanced the shear strength of the solder joints, regardless of the tip height. The fraction of ductile (solder) fracture decreased when the shearing speed was raised from 0.5 to 3.0 m/s. With an increasing tip height from 10 to 50 and 135 μm, the fracture mode changed from pad lift to mixed (ductile and brittle) and ductile fracture, respectively, while the shearing energy also increased in the same order. The shear energy had a proportional relationship with the fraction of the solder fracture.

고속전단 시험을 이용한 Sn-37Pb BGA solder joints의 기계적 신뢰성 특성 평가

장진규,하상수,하상옥,이종근,문정탁,박재현,서원찬,정승부,Jang, Jin-Kyu,Ha, Sang-Su,Ha, Sang-Ok,Lee, Jong-Gun,Moon, Jung-Tak,Park, Jai-Hyun,Seo, Won-Chan,Jung, Seung-Boo 한국마이크로전자및패키징학회 2008 마이크로전자 및 패키징학회지 Vol.15 No.4

본 연구에서는 BGA(Ball Grid Array) 솔더 접합부에 high impact가 가해졌을 경우 접합부의 기계적 특성에 대해서 연구하였다. 시편은 ENIG(Electroless Nickel Immersion Gold) 표면 처리된 FR-4 기판 위에 직경이 500 ${\mu}m$인 Sn-37Pb 솔더볼을 BGA 방식으로 배열하고 리플로우(Reflow)를 통하여 제작하였다. HTS(High Temperature Storage) 테스트를 위해, 시편을 일정한 온도의 $120^{\circ}C$에서 250시간 동안 시효처리(Aging)를 실시하였다. 시효처리 후, 각각의 시편은 고속 전단 시험기(Dage-4000HS)를 이용하여 속도 변수는 0.01, 0.1, 1, 3 m/s로 설정하여 고속전단 시험을 실시하였다. 전단시험 후, 솔더 접합 계면과 파면을 주사전자현미경(Scanning Electron Microscope, SEM)을 통하여 관찰하였다. 솔더 접합 계면에는 $Ni_3Sn_4$의 금속간 화합물이 성장하였으며, 시효처리 후, 솔더 접합 계면에 생성된 금속간 화합물의 두께가 증가하는 것을 관찰 할 수 있었다. 전단 시험 결과, 전단 속도가 빨라짐에 따라 전단 강도값은 증가하는 경향을 나타내었다. 솔더 접합부의 파단은 전단 속도와 시효처리 시간에 따라 다양한 파괴 모드로 진행됨을 알 수 있었다. 또한, 파괴 모드는 연성파괴 형상을 보이다가 전단속도가 증가함에 따라 취성 파괴 형상으로 변하는 것을 알 수 있었다. The mechanical shear strength of BGA(Ball Grid Array) solder joints under high impact loading was investigated. The Sn-37Pb solder balls with a diameter of $500{\mu}m$ were placed on the pads of FR-4 substrates with ENIG(Electroless Nickel Immersion Gold) surface treatment and reflowed. For the High Temperature Storage(HTS) test, the samples were aged a constant testing temperature of $120^{\circ}C$ for up to 250h. After the HTS test, high speed shear tests with various shear speed of 0.01, 0.1, 1, 3 m/s were conducted. $Ni_3Sn_4$ intermetallic compound(IMC) layer was observed at the solder/Ni-P interface and thickness of IMC was increased with aging process. The shear strength increased with increasing shear speed. The fracture surfaces of solder joints showed various fracture modes dependent on shear speed and aging time. Fracture mode was changed from ductile fracture to brittle fracture with increasing shear speed.

고속전단시험의 표준화를 위한 Sn3.0Ag0.5Cu 솔더볼의 전단특성

정도현,이영곤,정재필,Jung, Do-Hyun,Lee, Young-Gon,Jung, Jae-Pil 한국마이크로전자및패키징학회 2011 마이크로전자 및 패키징학회지 Vol.18 No.1

고속전단시힘의 표준화를 위한 기초 연구의 일부로 Sn-3.0wt%Ag-0.5wt%Cu 솔더 볼의 고속전단특성에 대한 연구를 수행 하였다. 고속전단 시험편 제작을 위해 직경 450 ${\mu}m$의 솔더 볼을 FR4 PCB (Printed Circuit Board) 위에 장착한 후 $245^{\circ}C$ 온도에서 리플로 솔더링을 행하였다. PCB 상의 금속 패드로는 ENIG (Electroless Nickel/mmersion Gold, i.e Cu/Ni/Au)와 OSP (Organic Solderability Preservative, Cu 패드)를 사용하였다. 고속전단 속도는 0.5~3.0 m/s 범위, 전단 팁의 높이는 10~135 ${\mu}m$ 범위에서 변화시켰다. 실험결과로서, OSP 패드의 경우 전단 팁 높이 증가에 따라 연성 파괴가 증가하였으며, 전단속도 증가에 따라 연성파괴는 감소되었다. ENIG 패드의 경우에도 전단 팁 높이 증가에 따라 연성 파괴가 증가하였다. 전단 팁 높이 10 ${\mu}m$(볼 직경의 2%)는 패드 박리 파괴가 대부분이어서 전단파면 관찰에는 부적절한 높이였다. 고속전단에너지는 OSP 및 ENIG 패드 모두 전단 팁 높이 증가에 따라 증가하는 경향을 보였다. Shearing characteristics of Sn-3.0wt%Ag-0.5wt%Cu ball for standardization of high speed shear test were investigated. The solder ball of 450 ${\mu}m$ in diameter was reflowed at $245^{\circ}C$ on FR4 PCB (Printed Circuit Board) to prepare a sample for the high-speed shear test. The metal pads on the PCB were OSP (Organic Solderability Preservative, Cu pad) and ENIG (Electroless Nickel/Immersion Gold, i.e CulNi/Au). Shearing speed was varied from 0.5 to 3.0 m/s, and tip height from 10 to 135 ${\mu}m$. As experimental results, for the OSP pad, a ductile fracture increased with tip height, and it decreased with shearing speed. In the case of ENIG pad, the ductile fracture increased with the tip height. The tip height of 10 ${\mu}m$ (2% of solder ball diameter) was unsuitable since the fracture mode was mostly pad lift. Shear energy increased with increasing shearing tip height from 10 to 135 ${\mu}m$ for both of OSP and ENIG pads.

Shear strength evaluation of RC solid piers of high-speed railway bridges in China

Wei Guo,Chao Fan,Yao Cui,Chen Zeng,Lizhong Jiang,Zhiwu Yu 국제구조공학회 2021 Structural Engineering and Mechanics, An Int'l Jou Vol.78 No.4

Piers are the main lateral force-resisting members of high-speed railway (HSR) bridges used in China and are characterized by low axial load ratios, low longitudinal reinforcement ratios, low stirrup ratios, and high shear span ratios. It is well known that flexural, flexural-shear, and shear failures of piers may occur during an earthquake. In this study, a new shear strength model was developed to simulate the seismic failure of HSR solid piers accurately. First, low cyclic-loading test data of solid piers obtained in recent years were collected to set up a database for model verification. Second, based on the test database, the applicability of existing shear strength models was evaluated. Finally, a new shear strength model for HSR solid piers with round-ended cross-sections was derived based on the truss model and ultimate equilibrium theory. In comparison with existing models, it was demonstrated that the proposed model could be used to predict the shear strength of HSR piers more accurately.

Sn-Ag-Cu-In 4원계 무연솔더 조인트의 고속 전단 특성

김주형,현창용,Kim, Ju-Hyung,Hyun, Chang-Yong 한국마이크로전자및패키징학회 2014 마이크로전자 및 패키징학회지 Vol.21 No.2

본 연구에서는 고속 전단시험의 변형속도를 500 mm/s로 설정한 상태에서 Sn-Ag-Cu계(Sn-1.0wt.%Ag-0.5Cu 및 Sn-4.0Ag-0.5Cu)뿐만이 아니라 4종의 4원계 Sn-Ag-Cu-In 조성(Sn-1.0Ag-0.5Cu-1.0In, Sn-1.2Ag-0.5Cu-0.4In, Sn-1.2Ag-0.5Cu-0.6In, Sn-1.2Ag-0.7Cu-0.4In)을 포함하는 무연 솔더 접합부의 솔더링 직후 및 시효 시간에 따른 파면 생성결과, 접합강도 및 접합부 파괴에너지값의 변화를 측정, 비교해 보았다. 그 결과, 리플로우 솔더링 직후 및 $125^{\circ}C$에서의 500 시간 시효까지 주로 연성 파괴모드 및 준연성 파괴모드가 관찰되었으며, 준연성 파괴모드의 발생 빈도를 분석할 때 고속 전단조건에서 상용 무연 솔더 조성인 Sn-3.0Ag-0.5Cu 이상의 연성파괴 특성을 나타내는 것으로 파악되었다. 또한 4원계 무연 솔더 조인트는 평균적으로 Sn-Ag-Cu계 조성 수준의 파단에너지값을 나타내었는데, 약 100 시간의 시효 후 최고의 파단에너지값이 관찰되었으나 500 시간의 시효 후에는 파단에너지값의 확연한 감소가 관찰되어 500 시간의 시효시점부터 솔더 접합 계면부의 신뢰성 감소가 가속화되는 경향을 관찰할 수 있었다. With Pb-free solder joints containing Sn-Ag-Cu-based ternary alloys (Sn-1.0 wt.%Ag-0.5Cu and Sn-4.0Ag-0.5Cu) and Sn-Ag-Cu-In-based quaternary alloys (Sn-1.0Ag-0.5Cu-1.0In, Sn-1.2Ag-0.5Cu-0.4In, Sn-1.2Ag-0.5Cu-0.6In, and Sn-1.2Ag-0.7Cu-0.4In), fracture-mode change, shear strengths, and fracture energies were observed and measured under a high-speed shear test of 500 mm/s. The samples in each composition were prepared with as-reflowed ones or solid-aged ones at $125^{\circ}C$ to 500 h. As a result, it was observed that ductile or quasi-ductile fracture modes occurs in the most of Sn-Ag-Cu-In samples. The happening frequency of a quasi-ductile fracture mode showed that the Sn-Ag-Cu-In joints possessed ductile fracture properties more than that of Sn-3.0Ag-0.5Cu in the high-speed shear condition. Moreover, the Sn-Ag-Cu-In joints presented averagely fracture energies similar to those of Sn-Ag-Cu joints. While maximum values in the fracture energies were measured after the solid aging for 100 h, clear decreases in the fracture energies were observed after the solid aging for 500 h. This result indicated that reliability degradation of the Sn-Ag-Cu-In solder joints might accelerate from about that time.

Sn-Ag-Cu-In 4원계 무연솔더 조인트의 고속 전단 특성

김주형,현창용 한국마이크로전자및패키징학회 2014 마이크로전자 및 패키징학회지 Vol.20 No.2

본 연구에서는 고속 전단시험의 변형속도를 500 mm/s로 설정한 상태에서 Sn-Ag-Cu계(Sn-1.0wt.%Ag-0.5Cu및 Sn-4.0Ag-0.5Cu)뿐만이 아니라 4종의 4원계 Sn-Ag-Cu-In 조성(Sn-1.0Ag-0.5Cu-1.0In, Sn-1.2Ag-0.5Cu-0.4In, Sn-1.2Ag-0.5Cu-0.6In, Sn-1.2Ag-0.7Cu-0.4In)을 포함하는 무연 솔더 접합부의 솔더링 직후 및 시효 시간에 따른 파면 생성결과, 접합강도 및 접합부 파괴에너지값의 변화를 측정, 비교해 보았다. 그 결과, 리플로우 솔더링 직후 및 125oC에서의500 시간 시효까지 주로 연성 파괴모드 및 준연성 파괴모드가 관찰되었으며, 준연성 파괴모드의 발생 빈도를 분석할 때고속 전단조건에서 상용 무연 솔더 조성인 Sn-3.0Ag-0.5Cu 이상의 연성파괴 특성을 나타내는 것으로 파악되었다. 또한4원계 무연 솔더 조인트는 평균적으로 Sn-Ag-Cu계 조성 수준의 파단에너지값을 나타내었는데, 약 100 시간의 시효 후최고의 파단에너지값이 관찰되었으나 500 시간의 시효 후에는 파단에너지값의 확연한 감소가 관찰되어 500 시간의 시효시점부터 솔더 접합 계면부의 신뢰성 감소가 가속화되는 경향을 관찰할 수 있었다. With Pb-free solder joints containing Sn-Ag-Cu-based ternary alloys (Sn-1.0 wt.%Ag-0.5Cu and Sn-4.0Ag-0.5Cu) and Sn-Ag-Cu-In-based quaternary alloys (Sn-1.0Ag-0.5Cu-1.0In, Sn-1.2Ag-0.5Cu-0.4In, Sn-1.2Ag-0.5Cu-0.6In,and Sn-1.2Ag-0.7Cu-0.4In), fracture-mode change, shear strengths, and fracture energies were observed and measuredunder a high-speed shear test of 500 mm/s. The samples in each composition were prepared with as-reflowed ones orsolid-aged ones at 125oC to 500 h. As a result, it was observed that ductile or quasi-ductile fracture modes occurs in themost of Sn-Ag-Cu-In samples. The happening frequency of a quasi-ductile fracture mode showed that the Sn-Ag-Cu-Injoints possessed ductile fracture properties more than that of Sn-3.0Ag-0.5Cu in the high-speed shear condition. Moreover,the Sn-Ag-Cu-In joints presented averagely fracture energies similar to those of Sn-Ag-Cu joints. While maximum valuesin the fracture energies were measured after the solid aging for 100 h, clear decreases in the fracture energies were observedafter the solid aging for 500 h. This result indicated that reliability degradation of the Sn-Ag-Cu-In solder joints mightaccelerate from about that time.

Sn-χ Ag-0.5Cu 무연 솔더 볼의 파단특성 연구

정종설(Jong-Seol Jeong),이용성(Yong-Sung Lee),신기훈(Ki-Hoon Shin),정성균(Seong-Kyun Cheong),장동영(Dong-Young Jang) 한국생산제조학회 2008 한국생산제조시스템학회 학술발표대회 논문집 Vol.2008 No.5

This paper presents a study on the failure characteristics of SnAgCu lead-free solder balls. To estimate the effect of Ag, three types of SnAgCu balls are first prepared by varying the weight percent of Ag ( 1.0, 3.0, 4.0 wt%) and then analyzed by reliability tests such as thermal shock, high speed ball shear, and drop tests. Thermal shock test reveals that the higher the weight percent of Ag is, the longer the fatigue life becomes. To the contrary, high speed ball-shear test and drop test show that the shear strength and the fracture toughness of solder balls are inversely proportional to the weight percent of Ag, respectively. Reasons for these observations will be further investigated in the future work.

Evaluation of mechanical properties of low-Ag ball grid array solder joints using a high-speed ball shear test

Bui, Q.V.,Jung, S.B. Elsevier Sequoia 2014 JOURNAL OF ALLOYS AND COMPOUNDS Vol.589 No.-

Solder joints of Sn-1.0Ag and Sn-1.0Ag-0.1Ce on electroless nickel/electroless palladium/immersion gold (ENEPIG) were studied and mechanically evaluated using a high-speed shear test. The effect of Pd thickness in ENEPIG on the reliability of solder joints was evaluated after multiple reflows. Microstructural observations of the solder joint interfaces and fractures after shear tests are shown. For comparison, conventional SAC305 Pb-free solder was also mechanically evaluated under the same conditions. By adding a thin Pd layer in ENEPIG surface finish, the intermetallic compound (IMC) layer's morphology of SAC305 change from needle type (as Pd thickness=0μm) to scallop type (as Pd thickness=0.1μm). While the intermetallic compounds (IMCs) layer's morphology of 1.0Ag solders change from facet type (as Pd thickness=0μm) to needle type (as Pd thickness=0.1μm). ENEPIG with thicker Pd layers was suitable for 1.0Ag solders during high speed shear test whereas conventional SAC305 showed the highest shear strength with an ENIG surface finish.

Sn-χAg-0.5Cu 무연 솔더의 파손특성에 관한 실험적 연구

정종설(Jong-Seol Jeong),이용성(Yong-Sung Lee),신기훈(Ki-Hoon Shin),정성균(Seong-Kyun Cheong),김종형(Jong-Hyeong Kim),장동영(Dong-Young Jang) 한국생산제조학회 2009 한국생산제조학회지 Vol.18 No.5

This paper presents an experimental study on the failure characteristics of SnAgCu lead-free solder balls. To estimate the effect of Ag, three types of SnAgCu balls are first prepared by varying the weight percent of Ag(1.0, 3.0, 4.0 wt%) and then analyzed by reliability tests such as thermal shock, high speed ball shear, and drop tests. Thermal shock test reveals that the higher the weight percent of Ag is, the longer the fatigue life becomes. To the contrary, high speed ball-shear test and drop test show that the shear strength and the fracture toughness of solder balls are inversely proportional to the weight percent of Ag, respectively. Reasons for these observations will be further investigated in the future work.