엔지니어링 플라스틱의 LED조명 방열판 적용

조영태(Young-Tae Cho) 한국기계가공학회 2013 한국기계가공학회지 Vol.12 No.4

As an advance study for the development of a heat sink for special purpose high power illumination, an investigation was made to find feasibility for the application of copper plated EP to a heat sink of small LED light of less than 10W installed in commercial product. In this study, the plated heat sink with EP copper was fabricated for the conventional LED light. It was used actually for finding heat radiation property and effectiveness of the heat sink accompanied with measurement of luminous intensity. The heat is radiated by transfer and dissipation only through the copper plated surface due to extremely low heat conductivity of EP in case of EP heat sink; however the total area of the plate plays the function of heat transfer as well as heat radiation in case of the aluminum heat sink. It seems that the volume difference of heat radiating material is so big that the temperature P₁ is 9.0~12.3% higher in 3W and 42.7~54.0% higher in case of 6W volume difference of heat radiating material is so big that the temperature P₁ is 9.0~12.3% higher in 3W and 42.7~54.0% higher in case of 6W even though heat transfer rate of copper is approximately 1.9 times higher than that of aluminum. It was thought that this is useful to utilize for heat sink for low power LED light with the low heating rate. Also, the illumination could be greatly influenced by the surrounding temperature of the place where it is installed. Therefore, it seems that the illumination installation environment must be taken into consideration when selecting illumination. Further study was expected on order to aims at development of an exterior surface itself made into heat radiation plate by application of this technology in future.

장기측정을 통한 바닥복사난방에서 방열판 추가에 따른 실내 온열쾌적성 향상 및 난방에너지 절감효과 분석

이승건(Seung Keon Lee),김민경(Min Kyung Kim),박병용(Beung Yong Park),송두삼(Doo Sam Song) 대한설비공학회 2019 대한설비공학회 학술발표대회논문집 Vol.2019 No.-

The purpose of this study is to improve heat transfer rate and heat storage capacity by adding the heat sink in radiant floor heating system, which is widely used in residential building in Korea. In this study, a long-term measurement was accomplished to analyze the effect of the heat sink on indoor thermal environment and energy consumption of the radiant floor heating. The experiment was conducted by 7.5m × 4.6m test cell. Cell #1 represents a set up of conventional radiant floor heating system without heat sink, and Cell #2 represents a set up of the analyzed radiant floor heating system with heat sink. One side of the test cell is exposed to the outdoor and three side of the test cell is on the indoor. The experimental conditions were the same. Indoor set-point temperature was 24℃ and the test cell was heated by electric boiler. As results of the long-term measurement, the total heating energy consumption was reduced about 11% when the heat sink was applied to the radiant floor heating system (Cell #2) compared to the conventional system (Cell #1). In addition, the indoor MRT(Mean Radiant Temperature) was ascended due to the uniformity of the floor surface temperature in Cell #2. This results in high OT(Operating Temperature) in Cell #2. The results show that the heating energy use can be reduced and indoor thermal comfort is improved by adding the heat sink in radiant floor heating system.

바닥 복사난방 구조체에 방열판 추가에 따른 축열능력 향상 및 에너지 절감효과의 분석

이승건(Seung Keon Lee),김민경(Min Kyung Kim),박병용(Beung Yong Park),송두삼(Doo Sam Song) 대한설비공학회 2020 대한설비공학회 학술발표대회논문집 Vol.2020 No.6

Adding heat sink to the radiant floor heating structure, the floor surface temperature becomes uniform, indoor radiant temperature is ascend, and heating energy is also reduced. This is because adding a heat sink improves the heat storage capacity of the radiant floor heating structure. The purpose of this study is to analysis of the heat storage performance and energy saving effect by adding heat sink to the radiant floor heating system by full scaled field measurement. A lot of heat flow meter and thermocouples were installed on the floor and surround wall surface to measure the amount of heat dissipation into the room and the heat storage amount of the floor structure. The heat storage capacity was calculated by the thermal equilibrium equation and the structure temperature gradient. With the measuring the three item, boiler input heat flow, indoor heat dissipation, floor structure heat storage, the improvement of heat storage capacity and heating performance with adding the heat sink in radiant floor heating system were analyzed. By adding a heat sink, the heat storage capacity of the floor structure was improved by about 12%, and as a result, an energy saving effect of about 22% was obtained.

철도차량용 고휘도 LED 전조등 방열판 해석을 위한 설계인자 검토

이승일(Seung-Il Lee),장진영(Chin-Young Chang),송문석(Moon-Shuk Song) 한국철도학회 2014 한국철도학회 학술발표대회논문집 Vol.2014 No.10

LED 는 다른 조명용 광원에 비해 친환경적이고 고에너지 효율과 고수명이라는 장점을 가지고 있으나, 출력이 높아질 수 온도상승으로 LED 수명이 급격히 감소되는 방열문제의 근본적인 취약점을 가지고 있다. 이를 위한 해결방안으로 자연대류, 강제대류, 히트파이프 냉각기술 등이 국내외에서 학술적으로 연구되고 있다. 본 연구에서는 철도차량용 고휘도 LED 전조등 기술개발과정 중 방열판의 개발방향에서 방열효율을 높일 수 있는 방열판 설계에 대한 시뮬레이션 수행을 위한 해석조건과 방법을 검토하였다. 또한 방열판의 재질, 기둥과 바닥판 내홀, 핀 개수, 핀 높이, 열저항 등의 설계인자 변화가 방열판 특성에 미치는 영향을 물리적으로 검토하였다. Has the advantage of being environmentally friendly and high energy efficiency and long life than the other illumination light source is a LED. However, this can increase the output temperature of the heat sink has a fundamental problem that this vulnerability LED life to rise sharply. The academic and research at home and abroad such as natural convection, forced convection, heat pipe cooling technology for this solution. In this study, we review the analytical conditions and methods for the simulation performed on the heat-sink design to increase efficiency in the room of the railway vehicle Brightness LED headlight technology development direction of sink development. Also examined the effects of physical impacts, such as the heat sink material properties of the heat sink, pillars and floor plate inner hole, pin number, pin high, heat resistance factor design changes.

열전도성 플라스틱을 이용한 30W급 LED light engine의 방열설계에 관한 연구

최원호,최두호,박대희 한국기계기술학회 2015 한국기계기술학회지 Vol.17 No.1

The study will design the structural optimization of 30W LED heat sink using the thermal conductive plastic materials. The advantages of thermal conductive plastic heat sink are having formability and being able to lighten products. A heat sink was optimized in terms of the number, and the thickness of fins and the base thickness of the heat sink, using the Heatsinkdesigner software. Also by using SolidWorks Flow simulation and thermal analysis software, the thermal characteristics of the heat sink were analyzed. As the result, the optimized heat sink has 22 fins, which are 1.5mm thick and a 3.8mm-thick base. The weight of the heat sink was 310g, and the highest and the lowest temperature were 64.93℃ and 45.96℃ respectively. Because of the low thermal conductivity of the thermal conductive plastic, the highest and the lowest temperature of the thermal conductive plastic heat sink were 14.3℃ higher and 2.19℃ lower respectively than an aluminum heat sink.

전력기기용 히트파이프 냉각장치에서 온도 편차의 통계적 평가

한창우(Chang-Woo Han),성상철(Sang-Chul Sung),정승붕(Seung-Boong Jeong) 대한기계학회 2019 대한기계학회 춘추학술대회 Vol.2019 No.11

The difference of the cooling performance between the heat sinks may vary depending on the operator or the time of production, even if a number of heat sinks are manufactured under the same process. And even in the same control algorithm and physical configuration, there is the difference of the electric loss between the power devices due to the current unbalance in the phase or between phases. In this paper, the deviation of the cooling performance of the heat sinks was statistically analyzed by measuring the temperature on the heat sink with heating blocks. The temperature of the heat sink with IGBT modules was then measured under various losses to assess the deviation of the cooling performance between heat sinks due to mechanical parameters such as the airflow rate and the electric parameters such as the current unbalance. As a result, the deviation of the cooling performance among a number of heat sinks was about ±5%, and the deviation of the cooling performance for the sub-system was found to be ±12%. The upper and lower specification limits on the IGBT stack compared to the heat sink component was increased due to uncontrollable factors such as the state of the power system. The heat sink with heat pipes applied the power conditioning system connected in a power system is expected to reduce the operating range by nearly 14% than ideal manufacturing and experimental conditions.

회로 안정화 부품의 수명예측을 위한 정밀 발열량 산정 기법 개발

김재중(Kim Jaejung),장석원(Chang Seogwon) 대한기계학회 2005 대한기계학회 춘추학술대회 Vol.2005 No.5

Transistor and Regulator I.C which are usally used in the power supply circuit of electronic equipment play an important role in circuit safety. In the case of high heat dissipation chips, they should be operated within the temperature limit. So various heat sinks are used for cooling. Unnecessarily big sized heat sink is used frequently because of miscalculations of heat dissipation of chips. Therefore, this paper has suggested the exact estimation method of heat dissipation for various chips in the circuit. The developed method shows that the heat dissipation is a function of heat sink temperature and ambient temperature. Also, the function is related to the temperature difference from heat sink temperature and ambient temperature. Additionally, the heat dissipation estimation program is in good agreement with the measurement.

동도금 EP방열판에 의한 소형LED조명등 방열

조영태(Young-tae Cho) 한국생산제조학회 2011 한국생산제조학회지 Vol.20 No.1

Recently, the electronic parts are to be thinner plate, smaller size, light weight material and CPU, HDD and DRAM in all the parts have been produced on the basis of the high speed and greater capacity. Also, conventional goods have replaced a LED (Light-Emitting Diode) in lighting products so; such industry devices need to have cooling. To maximize all the performance on the heat-radiated products, the area of heat-radiated parts is required to be cooled for keeping the life time extension and performance of product up. Existing cooling systems are using radiant heat plate of aluminum, brass by extrusion molding, heat pipe or hydro-cooling system for cooling. There is a limitation for bringing the light weight of product, cost reduction, molding of the cooling system. So it is proposed that an alternative way was made for bringing to the cooling system. EP (Engineering Plastic) of low-cost ABS (Acrylonitrile butadiene styrene Resin) and PC (Polycarbonate) was coated with brass and the coating made the radiated heat go up. The performance of radiant heat plate is the similar to the existing part. We have studied experimentally on the radiated heat plate for the light-weight, molding improvement and low-cost. From now on, we are going to develop the way to replace the exiting plate with exterior surface of product as a cooling system.

반도체 테스트 장비의 발열 부위에서 방열판 효과의 열전달 해석

음푸른별(Pu-Reun-Byul Eum),안지은(Ji Eun An),김인한(In Han Kim),김용운(Yong Woon Kim) 대한기계학회 2015 대한기계학회 춘추학술대회 Vol.2015 No.11

Final test in semiconductor manufacturing process is a very important step for quality control and cost reduction. The heat generated by the FOB (Fan Out Buffer) chips which is attached on the bottom side of socket board in the semiconductor test equipment causes target testing semiconductor’s temperature increasing and sometimes test equipment shutting down. Moreover, it makes confusing on deciding pass or fail. These problems would be the reasons of increasing test time and cost in semiconductor test process. One way to improve these phenomena is attaching a heat sink to the heating area. This study is about prediction of the effects by heat sink attachment using Computational Fluid Dynamics (CFD) and calculation of decreasing device temperature (target testing semiconductor) once heat sink is attached to the heat area.

Package on Package의 방열성능 향상을 위한 수치적연구

김지훈(JiHoon Kim),김주현(JooHyun Kim),김길환(GilHwan Kim),차명호(MyoungHo Cha),이혁(Hyouk Lee) 한국전산유체공학회 2013 한국전산유체공학회 학술대회논문집 Vol.2013 No.5

POP(Package on Package) technology that conoposed total module with making memory and logic to package through vertical stacking is taken notice to core of package technology because of anticipating high degree of accumulation. but because in-out put’s interval and chip’s thickness must be minimum, so heat generation is inflence on chip’s efficiency. therefore in this experiment, temperature of heat generation effected heat sink or solder ball is analized and compared through interpretarion of FVM(Finite Volume Method) for enhancing heat transferation. Putting heat sink on POP, heat generation temperature of die decreased 6℃ average. And putting solder ball or heat sink between top package and bottom package, heat of top package is tranfered to bottom package and ambient fluid, degree of die decreased 10℃ with putting solder ball and 12℃ with putting heat sink. and die of bottom package is expected to receive minuscule affection of heat sink or solder ball