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미세피치 패키지 적용을 위한 thin ENEPIG 도금층의 솔더링 특성
백종훈,이병석,유세훈,한덕곤,정승부,윤정원,Back, Jong-Hoon,Lee, Byung-Suk,Yoo, Sehoon,Han, Deok-Gon,Jung, Seung-Boo,Yoon, Jeong-Won 한국마이크로전자및패키징학회 2017 마이크로전자 및 패키징학회지 Vol.24 No.1
본 연구에서는 미세피치 패키지 적용을 위한 기초 실험으로 thin ENEPIG(Electroless Nickel Electroless Palladium Immersion Gold) 도금층을 형성하여 솔더링 특성을 평가하였다. 먼저, Sn-3.0Ag-0.5Cu (SAC305) 솔더합금에 대한 thin ENEPIG 도금층의 젖음 특성이 평가되었으며, 순차적인 솔더와의 반응에 대한 계면반응 및 솔더볼 접합 후 고속 전단 시험을 통한 접합부 기계적 신뢰성이 평가되었다. 젖음성 시험에서 침지 시간이 증가함에 따라 최대 젖음력은 증가하였으며, 5초의 침지 시간 이후에는 최대 젖음력이 일정하게 유지되었다. 초기 계면 반응 동안에는 $(Cu,Ni)_6Sn_5$ 금속간화합물과 P-rich Ni 층이 SAC305/ENEPIG 계면에서 관찰되었다. 연장된 계면반응 후에는 P-rich Ni 층이 파괴 되었으며, 파괴된 P-rich Ni 층 아래에는 $(Cu,Ni)_3Sn$ 금속간화합물이 생성되었다. 고속 전단 시험의 경우, 전단속도가 증가함에 따라 취성 파괴율이 증가하였다. In this paper, we evaluated the solderability of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layer for fine-pitch package applications. Firstly, the wetting behavior, interfacial reactions, and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate were evaluated. In the wetting test, maximum wetting force increased with increasing immersion time, and the wetting force remained a constant value after 5 s immersion time. In the initial soldering reaction, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) and P-rich Ni layer formed at the SAC305/ENEPIG interface. After a prolonged reaction, the P-rich Ni layer was destroyed, and $(Cu,Ni)_3Sn$ IMC formed underneath the destroyed P-rich Ni layer. In the high-speed shear test, the percentage of brittle fracture increased with increasing shear speed.
Sn-3.0Ag-0.5Cu 솔더 접합부의 계면반응과 취성파괴율에 미치는 Thin ENEPIG 도금두께의 영향
백종훈(Jong-Hoon Back),유세훈(Sehoon Yoo),한덕곤(Deok-Gon Han),정승부(Seung-Boo Jung),윤정원(Jeong-Won Yoon) 대한용접·접합학회 2018 대한용접·접합학회지 Vol.36 No.5
In this paper, we evaluated the interfacial reactions and brittle fracture behaviors of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layers with different Ni and Pd thicknesses for fine-pitch package applications. Firstly, the interfacial reactions and mechanical reliability of Sn-3.0Ag-0.5Cu (SAC305)/thin ENEPIG solder joints were evaluated. (Cu,Ni)6Sn5 intermetallic compound (IMC) was formed at all of the thin ENEPIG interfaces, and P-rich Ni layer was also observed at the joint interface of the Pd substrate with 0.3 ㎛ Ni thickness. The interfacial IMC thickness decreased with increasing Ni and Pd thicknesses. In addition, the IMC thickness was affected by the contents of the Pd plating layer. The IMC thickness for the Pd-P substrate was thicker than that for the Pd substrate. In the high-speed shear test, the brittle fracture rate decreased with increasing Ni and Pd thickness. Also, the brittle fracture rate was affected by the components of the Pd plating layer, and the brittle fracture rate for the Pd substrate was lower than that for the Pd-P substrate. The ENEPIG joint with thicker Ni plating layer had superior interfacial stability and mechanical reliability.
Review of Electrically Conductive Adhesive Technologies for Electronic Packaging
( Myung Jin Yim ),( Kyung Wook Paik ) 대한금속재료학회 ( 구 대한금속학회 ) 2006 ELECTRONIC MATERIALS LETTERS Vol.2 No.3
Conductive adhesives (ICAs Isotropic Conductive Adhesive, ACAs; An-isotropic Conductive Adhesive & NCAs; Non-conductive Adhesive) offers promising Pb-free process and material solutions for electronic packaging technology to be fine pitch interconnects, low cost and low temperature process and environmentally clean approaches. ICA has been developed and used widely for traditionally solder replacement, especially in surface mount devices and flip chip application. It also need to be lower cost and higher electrical/mechanical and reliability performances. ACAs have been widely used in flat panel display modules to be high resolution, light weight, thin profile and low power consumption in the film forms (Anisotropic Conductive Films; ACFs) for last decades. Multi-layered ACF structures such as double and triple-layered ACFs were developed to for last decades. Multi-layered ACF structures such as double and triple-layered ACFs were developed to meet fine pitch interconnection, low temperature curing and strong adhesion requirements. High mechanical reliability, good electrical performance at high frequency level and effective thermal conductivity for high current density are some of required properties for ACF materials to be pursued for wide usage in flip chip technology. Recently, NCAs are becoming promising for ultra-fine pitch interconnection and low cost joining materials in electronic packaging applications. In this paper, an overview on the recent development and applications of conductive adhesives for electronic packaging with focus on fine pitch capability, electrical/mechanical/thermal performance and wafer level package application are described.
Reliability of an Ultra-Fine-Pitch COF Flip-Chip Package Using Non-Conductive Paste
김해연,Kyung-Eun Min,이준식,이소정,Sung-Soo Lee,김준기 대한금속·재료학회 2016 ELECTRONIC MATERIALS LETTERS Vol.12 No.1
Ultra-fine-pitch chip-on-film (COF) packages such as display-drive-integratedcircuit (DDI) modules are manufactured through an underfill processfollowing Au-to-Sn thermo-compression bonding. As the interconnectionpitch becomes finer and is reduced to less than 25 um, however, an alternativeflip-chip technology, such as non-conductive paste (NCP) bonding, is neededin place of the capillary underfill process. In this study, new NCP formulationsare investigated to achieve rapid curing at a temperature high enough to form ametallic bond between the bump and the pad. An appropriate curing agent wasdetermined through a dielectric analysis (DEA). COF samples were preparedwith a DDI chip 11,772 × 924 um in size and with a 38 um-thick polyimideflexible printed circuit by both NCP bonding and thermo-compressionunderfillprocesses. Pressure cooker tests lasting as long as 192 h revealed thatthe reliability of the NCP sample against high temperatures and high humiditylevels exceeded somewhat that of the underfill sample. In thermal cycling testup to 500 cycles, however, the reliability of the NCP sample was inferior tothat of the underfill sample. It was considered that unbonded faults and NCPtrapping at the bump-to-pad joint were responsible for the premature failure ofthe NCP sample under a thermal cycling condition.
미세피치 연성인쇄회로기판 대응을 위한 NCP 패키징 공정설계 및 분석
심재홍(Jae Hong Shim),차동혁(Dong Hyuk Cha) 제어로봇시스템학회 2010 제어·로봇·시스템학회 논문지 Vol.16 No.2
Recently, LCD (Liquid Crystal Display) requires various technical challenges; high definition, high quality, big size, and low price. These demands more pixels in the fixed area of the LCD and very fine lead pitch of the driving IC which controls the pixels. Therefore, a new packaging technology is needed to meet such technical requirement. NCP (Non Conductive Paste) is one of the new packaging methods and has excellent characteristics to overcome the problems of the ACF (Anisotropic Conductive Film). In this paper, we analyzed the process of the NCP for COF (Chip on FPCB) and proposed the key design parameters of the NCP process. Through a series of experiments, we obtained the stable values of the design parameters for successful NCP process.
마이크로 전자기판의 미세 피치 블라인드 비아홀의 충진 거동
이민수,이효수,Yi Min-Su,Lee Hyo-S. 한국마이크로전자및패키징학회 2006 마이크로전자 및 패키징학회지 Vol.13 No.1
새로운 잔류 기공 추출 공정을 적용하여 Blind via hole(BVH)의 형상에 따라 발생되는 잔류기공 특성, 거동 및 신뢰성평가를 수행하였다. 잔류 기공 추출 공정을 적용한 시편에서는 잔류기공이 완전히 제거 되었으며, 기존 공정으로 제조된 시편에 비하여 40% 수준의 향상된 결과를 나타내었다. BVH의 형상에 관계없이 1.5기압수준으로 약 30초 이상 동안 추출하면 BVH내부의 잔류기공은 제거 되어지며 JEDEC 기준의 신뢰성으로 평가한 결과 BVH내부에 잔류기공은 존재하지 않았다. The properties, behavior and reliability of the residual void in blind via hole(BVH) were carried out for the shape of BVH using the void extraction process. The residual void was perfectly removed in the specimens applied by the void extraction process, which was improved by 40% rather than the conventional process. The residual void in BVH was to be eliminated under a condition of 1.5 atm for more 30 sec with regardless of the shape of BVH. It was also observed that the residual void in BVH was not formed after the reliability test with JEDEC standard.