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태양광발전 전력변환장치용 GaN-FET의 방열효율 향상을 위한 PCB 방열구조 열해석
이천규(Lee Cheonkyu),정효재(Jeong Hyo Jae) 한국태양에너지학회 2022 한국태양에너지학회 논문집 Vol.42 No.6
In 2021, the solar power generation capacity of South Korea was 14.6 GW, accounting for 71% of the total renewable energy generation capacity. The market for photovoltaic power conversion devices with high efficiency and power density is expanding rapidly in the country. Gallium Nitride (GaN), a compound semiconductor with a wide band gap, can be used under high voltage and current compared to silicon materials, resulting in its wide use in photovoltaic power conversion devices. Excellent heat dissipation performance of GaN-based devices should be achieved due to their significantly high power and efficiency. In this study, the heat dissipation characteristics of a PCB with FR4 (Flame Retardant 4) material composed of various heat dissipation structures for the effective heat dissipation of GaN-FETs for power conversion systems applicable to a 3 kW solar power generation system were investigated using thermal analysis. Part of the heat generated from the GaN-FET was directly dissipated on its surfaces to the external air, and the other part was transferred to the PCB through conduction and then discharged to the external air through convection on the surfaces of the PCB package. Via holes were considered to improve the heat transfer rate of the PCB in the thickness direction, and a heat sink was applied to expand the heat transfer area. In this study, the heat dissipation characteristics were investigated based on four types of heat dissipation structures of the PCB using the ANSYS transient thermal analysis program. The effect of via holes exposed to external air were analyzed using two types of heat dissipation structures. In addition, two other types of heat dissipation structures were analyzed to compare the top and top/bottom cooling of the PCB package. It was observed that the efficiencies of heat dissipation of the via holes that were unexposed to external air and in both the top and bottom cooling cases were more advantageous than that of the exposed holes and the top cooling case, respectively.
정효재(Hyo Jae Jeong),곽봉우(Bongwoo Kwak),김명복(Myungbok Kim),차동안(Dong An Cha) 대한기계학회 2021 대한기계학회 춘추학술대회 Vol.2021 No.11
Heat generation of chip is recently increasing due to high performance and miniaturization trend of electronic devices, while the thickness and area of the devices are limited. When heat is not released quickly from the chip attached to the printed circuit board (PCB), the temperature of chip will continue to rise, resulting in poor performance and durability. Therefore, it is important to design heat dissipation of PCBs to effectively release heat from chip. Heat from the chip is transferred to the PCB through conduction, and discharged from the PCB and the chips surface to the outside air through convection. In this study, two structure of heatsinks were applied for effective cooling of heat generated from a gallium nitride field effect transistor (GaN-FET), and the heat dissipation characteristics were analyzed according to each heatsink structure using numerical analysis.
방열소재로의 응용을 위한 고분자 복합소재 내 이방성 필러 구조 제어 연구동향
민성배 ( Seong-bae Min ),김채빈 ( Chae Bin Kim ) 한국복합재료학회 2022 Composites research Vol.35 No.6
전자 기기의 발달에 따라 발생하는 발열 문제를 해결하기 위해 높은 열전도도를 갖는 방열소재의 개발이 필요하다. 고분자 복합소재는 고분자의 장점과 열전도성 필러의 장점을 동시에 지녀 경량 방열소재로 각광받고 있다. 하지만, 산업적으로 요구되는 열전도도를 달성하기 위해서는 볼륨비로 60 이상의 고함량의 필러 충진이 요구되므로 최근에는 필러의 구조 제어를 통해 비교적 저함량의 필러 충진으로도 열 전달 경로를 최적화할 수 있는 연구들이 진행되고 있다. 본 리뷰에서는 고분자 복합소재 내 열전도성 이방성 필러의 구조를 제어해 비교적 적은 필러 함량으로 고열전도성 방열소재를 제작하는 다양한 전략을 소개하고자 한다. Efficient heat dissipation in current electronics is crucial to ensure the best performance and lifespan of the devices along with the users’ safety. Materials with high thermal conductivity are often used to dissipate the generated heat from the electronics to the surroundings. For this purpose, polymer composites have been attracted much attention as they possess advantages rooted from both polymer matrix and thermally conductive filler. In order to meet the thermal conductivity required by relevant industries, composites with high filler loadings (i.e., >60 vol%) have been fabricated. At such high filler loadings, however, composites lose benefits originated from the polymer matrix. To achieve high thermal conductivity at a relatively low filler loading, therefore, constructing the heat conduction pathway by controlling filler structure within the composites may represent a judicious strategy. To this end, this review introduces several recent approaches to manufacturing heat dissipating materials with high thermal conductivity by manipulating thermally conductive filler structures in polymer composites.
축방향 자속형 영구자석(AFPM) 전동기 냉각 유로 격벽 구조에 대한 방열 특성 해석
양성진(Sungjin Yang),신용우(Yong-Woo Shin),서정무(Jungmoo Seo),손기헌(Gihun Son) 대한기계학회 2021 대한기계학회 춘추학술대회 Vol.2021 No.11
As part of the low-carbonization that appears throughout the industry, the electrification of the conventional fossil fuel system is actively underway in the aviation propulsion. For electric propulsion for aviation, it is necessary to design and manufacture a motor with improved power density that can operate at low speed and high torque. The high heat loss that inevitably occurs in the process of pursuing high output and weight reduction requires the development of an improved cooling structure as well. The AFPM motor, which is the subject of this study, adopted a hybrid cooling method that has both air cooling and water cooling structures to effectively dissipate heat generated at the increased power density. For effective heat dissipation of the internal active parts, a partition structure was considered inside the hub having a complex coolant flow passage, and the cooling performance was investigated numerically. The purpose of this study is to suggest an appropriate cooling design direction by comparing and analyzing the change in coolant flow rate, pressure drop, and temperature change of major motor components by changing the internal partition structure of cooling passage under the same cooling flow rate.