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향나무類를 加害하는 알락명나방亞科의 韓國未記錄 1種 Dioryctria juniperella Yamanaka(나비目, 명나방科)
Bong-Kyu BYUN,Chul-Ha PARK,H. YAMANAKA,Buom-Young LEE 한국응용곤충학회 1997 한국응용곤충학회지 Vol.36 No.2
향나무류를 가해하는 향나무알락명나방(신칭)을 우리나라 미기록종으로 보고하며 성충 및 유충의 외부형태적 특징을 간략히 기술하였다. 금번조사를 통해 향나무, 누운향나무, 옥향나무 등 3종이 기주로 확인되었으며, 유충은 기주의 잎을 엮고 그 안에서 가해하는 것으로 조사되었다. A Phycitine species, Dioryctiria juniperella Yamanaka, is reported for the first time from Korea. Larval characters is also shown with its illustration. Juniperus chinensis L., J. chinensis var. globosa H., and J. procumbens S. are known as host plants for the species in this country.
山中寬(Yamanaka Hiroshi),白雲鶴(Baek Un Hak) 한국재활심리학회 2001 재활심리연구 Vol.8 No.1
This study, which is dealing with the stress management strategies for the prevention of school maladjustment, aims to prevent students from suffering the stress which is possible in the present and/or in the near future. The stress management education has been introduced as a means to effective self-control measure of the stress. In this study, reviewing the article published in the previous edition of The Contemporary Situation and Effect of Stress Management Education In Japan(Yamanaka, 2000), I tried to analyze students mental health problems in school in terms of student maladjustment and teacher stress, and described the effect of Stress Management Education through Pair-relaxation. Stress Management Education has been introduced to the grade schools for the last ten years in the United States and European countries. It will also be introduced in the year 2002 in Japan as planned in The New Curriculum and Instruction Guidelines. Stress Management Education will emerge as a major educational movement in Japan for the purpose of preventing stress in connection with Discretionary Hours, Physical Education, Morals, Homeroom Hours, and other curricular activities.
Yamanaka, Hiroaki,Ohtawara, Kaoru,Grutas, Rhommel,Tiglao, Robert B.,Lasala, Melchor,Narag, Ishmael C.,Bautista, Bartlome C. Korean Society of Earth and Exploration Geophysici 2011 지구물리와 물리탐사 Vol.14 No.1
In this study, empirical site amplifications and S-wave velocity profiles for shallow and deep soils are estimated using earthquake ground motion records in metropolitan Manila, the Philippines. We first apply a spectral inversion technique to the earthquake records to estimate effects of source, path, and local site amplification. The earthquake data used were obtained during 36 moderate earthquakes at 10 strong-motion stations of an earthquake observation network in Manila. The estimated Q value of the propagation path is modelled as $54.6f^{1.1}$. Most of the source spectra can be approximated with the omega-square model. The site amplifications show characteristic features according to surface geological conditions. The amplifications at the sites in the coastal lowland and Marikina Valley shows predominant peaks at frequencies from 1 to 5 Hz, while those in the central plateau are characterised by no dominant peaks. These site amplifications are inverted to subsurface S-wave velocity. We, next, discuss the relationship between the amplifications and average S-wave velocity in the top 30m of the S-wave velocity profiles. The amplifications at low frequencies are well correlated with the averaged S-wave velocity. However, high-frequency amplifications cannot be sufficiently explained by the averaged S-wave velocity in the top 30 m. They are correlated more with the average of S-wave velocity over depths less than 30 m.
A Fundamental Study for Creating 3D CG Animation of an Assembly Work
Yamanaka, Hiroki,Matsumoto, Toshiyuki,Shinoda, Shinji,Niwa, Akira Korean Institute of Industrial Engineers 2012 Industrial Engineeering & Management Systems Vol.11 No.2
This paper presents a new mode of expressing a 3D assembly work for creating a 3D CG animation without judgment by human from minimal required information. In the field of manufacturing, there are favorable movements in the utilization of 3D CAD for 3D simulation to shorten lead time for product development and pre-production. But simulating an assembly work has troubles to need huge quantity of manually input data. This paper discusses what minimal necessary information for creating 3D CG animations of assembly works is, focusing on the features of assembly works. Furthermore, a new mode of expressing a 3D assembly work is proposed as "state/change transition diagrams" (SCTD), which express arbitrary scenes in an assembly work as "state" and describe a sequential assembly work with "state" and "change", and the outline of its stepwise generation algorithm is also described. SCTD can be converted to a 3D CG animation of an assembly work without judgment by human. This paper focuses on the creating 3D CG animation of assembly works which workers use only their both hands.
Yamanaka, Kimihiro The Korean Microelectronics and Packaging Society 2011 마이크로전자 및 패키징학회지 Vol.18 No.3
Keys to high wiring density semiconductor packages include flip-chip bonding and build-up substrate technologies. The current issues are the establishment of a fine pitch flip-chip bonding technology and a low coefficient of thermal expansion (CTE) substrate technology. In particular, electromigration and thermomigration in fine pitch flipchip joints have been recognized as a major reliability issue. In this paper, electromigration and thermomigration in Cu/Sn-3Ag-0.5Cu (SAC305)/Cu flip-chip joints and electromigration in Cu/In/Cu flip chip joints are investigated. In the electromigration test, a large electromigration void nucleation at the cathode, large growth of intermetallic compounds (IMCs) at the anode, a unique solder bump deformation towards the cathode, and the significantly prolonged electromigration lifetime with the underfill were observed in both types of joints. In addition, the effects of crystallographic orientation of Sn on electromigration were observed in the Cu/SAC305/Cu joints. In the thermomigration test, Cu dissolution was accelerated on the hot side, and formation of IMCs was enhanced on the cold side at a thermal gradient of about $60^{\circ}C$/cm, which was lower than previously reported. The rate of Cu atom migration was found comparable to that of electromigration under current conditions.