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Siti Sofiyah Skh Ali,Bee Chin Ang,Serene Teh Seoh Hian 한국정밀공학회 2014 International Journal of Precision Engineering and Vol. No.
Transfer molding is the most effective method for molding encapsulation for semiconductor packaging due to low maintenance costand high production yield. Wire sweep is a critical moldability issue as excessive wire sweep will contact neighbouring wires, causingelectrical short that consequently leads to electrical failure of the package. Wire sweep characterization was carried out with variouswire locations, mold flow directions, wire lengths, wire pitches and wire angles on Low Quad Flat Packages (LQFP). JMP statisticalanalysis was performed to determine the significant factors and correlations of wire sweep performance. It was found that wire lengthhas the most significant correlation with wire sweep percentage. The four wires, two at the bottom-left and top-right (and hencedesignated as corner 2 and 4, respectively) exhibited the worst wire sweep when the mold gate was located at the top-left corner ofthe package. The wire sweep performance of seven wire layouts with varying wire lengths were also investigated. The results haverevealed and proven that the two wires (corner 2 and 4, respectively) exhibited a higher wire sweep percentage. Overall, it was foundthat wire X4 has the highest wire sweep deflection.