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Jingook Kim,Jun Fan,Ruehli, A. E.,Joungho Kim,Drewniak, J. L. IEEE 2011 IEEE transactions on microwave theory and techniqu Vol.59 No.8
<P>Partial inductances are computed herein for the via transitions between parallel planes. A hybrid method proposed for the inductance calculation correlates the definition of the partial inductance and a resonant cavity model. The hybrid method is corroborated by comparison with the partial-element equivalent-circuit and the cavity methods, as well as measurements. The portions of the plane net and via net inductances are quantified, and the contribution of each plane current to the plane net inductance is quantitatively analyzed.</P>
Hanfeng Wang,Siming Pan,Jingook Kim,Ruehli, Albert E.,Jun Fan IEEE 2013 IEEE transactions on components, packaging, and ma Vol.3 No.12
<P>In this paper, a new integral equation formulation for via structures is developed for the capacitance extraction between vias and planes. The formulation is initially developed for axially symmetric geometries and then extended to axially asymmetric geometries by changing the circular ring cells to arc cells. The extended method can be used to calculate the shared-antipad via structure, which is widely used in high-speed differential signal interconnects. In addition, the image theory is used to handle inhomogeneous media, and a new technique is given to reduce computational costs for via-to-plane structures based on properties of the capacitance-matrix elements. The proposed method is validated with a commercial finite element method-based tool for several practical via structures. The extracted capacitance is also incorporated into the physics-based via model and validated with full-wave simulations.</P>