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Dina V. Dudina,Vyacheslav I. Mali,Alexander G. Anisimov,Natalia V. Bulina,Michail A. Korchagin,Oleg I. Lomovsky,Ivan A. Bataev,Vladimir A. Bataev 대한금속·재료학회 2013 METALS AND MATERIALS International Vol.19 No.6
We present several possible microstructure development scenarios in Ti3SiC2-Cu composites during mechanical milling and Spark Plasma Sintering (SPS). We have studied the effect of in situ consolidation during milling of Ti3SiC2 and Cu powders and melting of the Cu matrix during the SPS on the hardness and electrical conductivity of the sintered materials. Under low-energy milling, (3-5) vol.%Ti3SiC2-Cu composite particles of platelet morphology formed, which could be easily SPS-ed to 92-95% relative density. Under high-energy milling, millimeter-scale (3-5) vol.%Ti3SiC2-Cu granules formed as a result of in situ consolidation and presented a challenge to be sintered into a bulk fully dense sample; the corresponding SPS-ed compacts demonstrated a finer-grained Cu matrix and more significant levels of hardening compared to composites of the same composition processed by low-energy milling. The 3 vol.% Ti3SiC2-Cu in situ consolidated and Spark Plasma Sintered granules showed an extremely high hardness of 227 HV. High electrical conductivity of the Ti3SiC2-Cu composites sintered from the granules was an indication of efficient sintering of the granules to each other. Partial melting of the Cu matrix, if induced during the SPS, compromised the phase stability and uniformity of the microstructure of the Ti3SiC2-Cu composites and thus it is not to be suggested as a pathway to enhanced densification in this system.
TiB<sub>2</sub>-Cu Interpenetrating Phase Composites Produced by Spark-plasma Sintering
Kwon, Young-Soon,V. Dudina, Dina,I. Lomovsky, Oleg,A. Korchagin, Michail,Kim, Ji-Soon The Korean Powder Metallurgy Institute 2003 한국분말재료학회지 (KPMI) Vol.10 No.3
Interpenetrating phase composites of $TiB_2$-Cu system were produced via Spark-Plasma Sintering (SPS) oi nanocomposite powders. Under simultaneous action of pressure, temperature and electric current titanium diboride nanoparticles distributed in copper matrix move, agglomerate and form a fine-grained skeleton. Increasing SPS-temperature and he]ding time promote densification due to local melting of copper matrix When copper melting is avoided the compacts contain 17-20% porosity but titanium diboride skeleton is still formed representing the feature of SPS . High degree of densification and formation of titanium diboride network result in increased hardness of high-temperature SPS-compacts.