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Thermal Analysis and Design of AlGaInP-based Light Emitting Diode Arrays
Zhang Ban,Zhongzhu Liang,Jingqiu Liang,Weibiao Wang,JinguangLv,Yuxin Qin 한국광학회 2017 Current Optics and Photonics Vol.1 No.2
LED arrays with pixel numbers of 3×3, 4×4, and 5×5 have been studied in this paper in order to enhancethe optical output power and decrease heat dissipation of an AlGaInP-based light emitting diode displaydevice (pixel size of 280×280 μm) fabricated by micro-opto-electro-mechanical systems. Simulation resultsshowed that the thermal resistances of the 3×3, 4×4, 5×5 arrays were 52°C/W, 69.7°C/W, and 84.3°C/W. The junction temperature was calculated by the peak wavelength shift method, which showed that themaximum value appears at the center pixel due to thermal crosstalk from neighboring pixels. The centraltemperature would be minimized with 40 μm pixel pitch and 150 μm substrate thickness as calculated bythermal modeling using finite element analysis. The modeling can be used to optimize parameters of highlyintegrated AlGaInP-based LED arrays fabricated by micro-opto-electro-mechanical systems technology.