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- 저자 : Jieshi Chen (검색결과 1 건)
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Jinhong Liu,Xinyi Jing,Jieshi Chen,Kyung‑Wook Paik,Peng He,Shuye Zhang 대한금속·재료학회 2024 ELECTRONIC MATERIALS LETTERS Vol.20 No.3
A structure composed of various Cu–Ni–Sn IMCs would develop from severe Joule heat and excessive elemental diff usionunder high-density current in the solder joints of fl exible printed circuit (FPC). Herein, we fi rstly observed the evolution ofa Cu 6 Sn 5 + Cu 3 Sn/(Ni,Cu) 3 Sn 4 hybrid structure in a μ-Cu/NiAu/Sn/Cu solder joint for full intermetallic compounds (IMCs)interconnect of fl exible electronics under isothermal aging condition by in-situ TEM. The joint was divided into two regions,the IMC type on the right region remained unchanged with dwell time prolonging, while the ratio of Cu 3 Sn on the left regionat various dwell times fi tted the JMAK model when the kinetic parameter n picked 1.5, indicating that grain boundary diff usionwas the predominant mechanism for transporting Cu atoms. The nucleation and growth of Cu 3 Sn grains were fi nishedin the Cu 6 Sn 5 layer. The nucleation of a Cu 3 Sn grain with a spherical cap shape was fi rstly captured by HRTEM, and Cu 3 Sngrains underwent a transformation from columnar to equiaxed when the dwell time was increased, making the morphologyof Cu 3 Sn grains in a μ-Cu/NiAu/Sn/Cu solder joint signifi cantly diff erent from the situation in larger solder joints. This studyis expected to provide an in-depth study of the microstructural evolution of micro Cu/NiAu/Sn/Cu solder joints under agingcondition and thereby expand their application in the microelectronic industry.
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