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Squeeze Casting 에 의한 Al-SiCp 복합재료의 제조에 있어서 가압력의 영향
문정탁,김명한,조형호 ( Jeong Tak Moon,Myung Han Kim,Hyung Ho Jo ) 한국주조공학회 1995 한국주조공학회지 Vol.15 No.1
N/A The Al-SiC_p composite was fabricated by the liquid mixing and squeeze casting method. The effects of squeezing pressure in the fabrication of the Al-SiC_p composite were studied by analysing microstructure and mechanical properties. The results could be summarized as follows; 1) The tensile strength and hardness of Al-SiC_p composite were increased as the squeezing pressure was increased. However, the elongation and amount of wear were decreased as the squeezing pressure was increased. 2) When the high squeezing pressure at the high molten temperature was applied in fabrication, the mechanical properties of Al-SiC_p composite were declined, which resulted from the deterioration of SiC_p particles in the matrix alloy. 3) The wear mechanism at the matrix alloy only was changed from adhesive wear to oxidation wear and from oxidation wear to fusion wear. However, the Al-SiC_p composite represented sliding wear mechanism resulting from the sliding action of SiC_p particles in the matrix alloy.
가열주형식 연속주조법에 의한 Al-Si 합금의 응고조직에 관한 연구
김원태,문정탁,김명한,조형호 ( Won Tae Kim,Jeong Tak Moon,Myung Han Kim,Hyung Ho Jo ) 한국주조공학회 1994 한국주조공학회지 Vol.14 No.5
N/A The horizontal continuous casting method with the heated mold was applied to study the solidification structures of the pure Al and Al-0.5wt%Si and Al-1.0wt%Si alloy rods. The results could be summarized as follows: 1. The S/L interface structures of pure Al represented the hexagonal cells at the casting speed of 590 and 350㎜/min, respectively. However, the hexagonal cells became irregular as the casting speed and(or) Si amount increased. 2. The striation increased as the Si amount and casting speed increased and was found to result from the occurrence of growth twin crystals by XRD analysis. 3. The striation did not affect the mechanical and electrical property of the drawn wire from the casted rod. This means the striation is not a serious defect which has to consider in the production of micro-sized fine wire in the drawing process.
박용성,권용민,손호영,문정탁,정병욱,강경인,백경욱,Park, Yong-Sung,Kwon, Yong-Min,Son, Ho-Young,Moon, Jeong-Tak,Jeong, Byung-Wook,Kang, Kyung-In,Paik, Kyung-Wook 한국마이크로전자및패키징학회 2007 마이크로전자 및 패키징학회지 Vol.14 No.4
본 논문에서는 다양한 조성의 주석-은-구리 합금계 솔더볼과 ENIG 및 Cu-OSP 패드와의 계면 반응에 대해 연구하였다. ENIG 패드와 미량의 Sb이 첨가된 합금 솔더와의 계면 반응 시 다른 솔더에 비해 매우 얇은 100 nm 내외의 두께를 가진 P-rich Ni layer가 형성되었다. 미량의 Ni이 첨가된 합금 솔더와 Cu-OSP 금속 패드와의 계면 반응 시에는 다른 솔더와는 달리 균일한 두께의 $Cu_6Sn_5$ 금속간화합물이 형성되었으며 추가 리플로우 시에 금속간화합물 입자가 거의 성장하지 않았다. 또한 $150^{\circ}C$의 장시간 열처리 시에 다른 솔더에 비해 매우 얇은 두께의 $Cu_3Sn$ 금속간화합물이 형성되었다. In this study, we investigated the interfacial reactions between various Sn-Ag-Cu(SAC) solder alloys and ENIG(Electroless Ni Immersion Gold) and Cu-OSP(Organic Solderability Preservative) pad finish. In the case of the interfacial reaction between Sb added SAC solder and ENlf thinner P-rich Ni layer was formed at the interface. In the case of the interfacial reaction between Ni added SAC solder and Cu-OSP, the uniform $Cu_6Sn_5$, intermetallic compounds(IMCs) were formed and $Cu_6Sn_5$ grain did not grow after multiple reflows. Thinner $Cu_3Sn$ IMCs were farmed at the interface between $Cu_6Sn_5$ and Cu-OSP after $150^{\circ}C$ thermal aging.
Sn-3.0wt.%Ag-0.5wt.%Cu 솔더 볼 접합부의 고속전단 특성
이영곤 ( Young Gon Lee ),이희열 ( Hee Yul Lee ),문정탁 ( Jeong Tak Moon ),박재현 ( Jai Hyun Park ),한신식 ( Shin Sik Han ),정재필 ( Jae Pil Jung ) 대한금속·재료학회 2009 대한금속·재료학회지 Vol.47 No.9
The effects of shear speed and tip height on the high speed shear test of Sn-3.0wt.%Ag-0.5wt.%Cu ball joints were investigated. Solder balls of 450 μm in diameter were reflowed at 245℃ on a FR4 PCB (Printed Circuit Board) in order to obtain a sample for the high-speed shear test. The UBM was comprised of Cu/Ni/Au, and the shear speed and tip height varied from 0.5 to 3.0 m/s, and from 10 to 135 μm, respectively. According to the experimental results, faster shear speed enhanced the shear strength of the solder joints, regardless of the tip height. The fraction of ductile (solder) fracture decreased when the shearing speed was raised from 0.5 to 3.0 m/s. With an increasing tip height from 10 to 50 and 135 μm, the fracture mode changed from pad lift to mixed (ductile and brittle) and ductile fracture, respectively, while the shearing energy also increased in the same order. The shear energy had a proportional relationship with the fraction of the solder fracture.
Mi-Song Kim(김미송),Won Sik Hong(홍원식),Sang Yeop Kim(김상엽),Sung Min Jeon(전성민),Jeong Tak Moon(문정탁) 대한용접·접합학회 2021 대한용접·접합학회지 Vol.39 No.4
Gold-coated silver wire was developed to alleviate the high cost of Au wire used in semiconductor packaging. Ball-bonding and stitch-bonding techniques were used to fabricate the dummy packaging material, comprising 97.3 % Ag, 97.3% Au-Coated Ag, and 99.99 %Au wires. The wire ball shear test (BST), the wire ball pull test (BPT), and the microstructural attributes of the ultrasonic bonding interfaces were compared with the initial properties, both before and after the highly accelerated stress test (HAST), conducted at 130 ℃ and 85% relative humidity (RH). The initial bonding strength for all the wire variants was ≈23~24 gf. Following the HAST, the bonding strength of the Ag wire, the Au-coated Ag wire, and the Au wire decreased by approximately 75 %, 47 %, and 17 %, respectively. The microstructure analysis revealed that cracks developed and propagated at the ends of the interface and that the Au-rich Au-Al intermetallic compound (IMC) inhibited the propagation of the crack at the ACA/Au wire interface. Additionally, it was discovered that the presence of the Ag-Au-Al IMC at the interface of the ACA wire reduced Kirkendall voids, which act as a barrier to Au-Al interdiffusion.
반도체 패키징용 금 코팅된 은 와이어의 초음파 접합 특성
김미송(Mi-Song Kim),홍원식(Wonsik Hong),김상엽(Sang Yeop Kim),전성민(Sung Min Jeon),문정탁(Jeong Tak Moon) 대한용접·접합학회 2021 대한용접학회 특별강연 및 학술발표대회 개요집 Vol.2021 No.5
본딩 와이어 (Bonding wire)는 반도체 집적회로 (Integrated circuit), FPGA (Field programmable gate array), 메모리 패키지(Memory package) 등에 적용되며, 반도체 소자의 신호를 전달하는 역할을 한다. 본딩 와이어 소재 종류에 따라 내부식성과 접합부 특성이 달라지므로 와이어 소재 선정이 매우 중요하다. 본딩 와이어 소재는 주로 내부식성과 접합 특성이 우수한 금 와이어 (Au wire)가 사용되어왔으며, 가격 경쟁력을 위해 대체 소재인 구리-팔라듐 (CuPd) 합금, 구리 (Cu), 은 (Ag), 알루미늄 (Al) 등이 적용되고 있다. 본 연구에서는 97.3%Ag, Au-Coated Ag (97.3%Ag), 99.99%Au 소재를 사용한 20.32 ㎛ (0.8 mil) 와이어를 볼 본딩 (Ball bonding) 및 스티치 본딩 (Stich bonding) 하여 더미 (Dummy) 패키지를 제작하였고, 130℃, 85% RH 조건의 고온가압시험 (Highly accelerated stress test, HAST) 시험 전후 와이어 볼 전단강도 (Wire ball shear test, BST) 및 인장강도 (Ball pull test, BPT) 그리고 와이어의 초음파 접합부 미세조직 특성 변화를 비교하였다. BST 결과 초기 접합강도는 약 23~24 gf로 비슷하였지만, HAST 시험 후 은 와이어, 골드 코팅된 은 와이어, 골드 와이어 접합강도는 각각 약 75%, 47%, 17% 감소하였다. 미세조직 분석결과 초음파 접합부의 금속간 화합물 (Intermetallic compound, IMC) 경계면에서 균열 (Crack)이 관찰되었고, 접합부 길이 대비 crack 길이는 Ag, Au-Coated Ag, Au Wire 각각 약 69%, 18%, 9%로 측정되었다. HAST 후 접합부 균열은 시험 중 수분에 의한 접합계면 부식과 IMC 형성이 주요 원인으로 판단되며, 본 연구를 통해 Au-Coated Ag가 기존의 Au wire를 대체할 수 있는 접합 특성을 나타내는 것으로 판단된다.
홍원식 ( Won Sik Hong ),김미송 ( Mi-song Kim ),김상엽 ( Sang Yeop Kim ),전성민 ( Sung Min Jeon ),문정탁 ( Jeong Tak Moon ),김영식 ( Youngsik Kim ) 한국부식방식학회 2021 Corrosion Science and Technology Vol.20 No.5
In this study, after measuring polarization characteristics of 97.3 wt% Ag, Au-Coated 97.3 wt% Ag (ACA) and 100 wt% Au wires in 1 wt% H<sub>2</sub>SO<sub>4</sub> and 1 wt% HCl electrolytes at 25℃, corrosion rate and corrosion characteristics were comparatively analyzed. Comparing corrosion potential (E<sub>CORR</sub>) values in sulfuric acid solution, ACA wire had more than six times higher ECORR value than Au wire. Thus, it seems possible to use a broad applied voltage range of bonding wire for semiconductor packaging which ACA wire could be substituted for the Au wire. However, since the E<sub>CORR</sub> value of ACA wire was three times lower than that of the Au wire in a hydrochloric acid solution, it was judged that the use range of the applied voltage and current of the bonding wire should be considered. In hydrochloric acid solution, 97.3 wt% Ag wire showed the highest corrosion rate, while ACA and Au showed similar corrosion rates. Additionally, in the case of sulfuric acid solution, all three types showed lower corrosion rates than those under the hydrochloric acid solution environment. The corrosion rate was higher in the order of 97.3 wt% Ag > ACA > 100 wt% Au wires.