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Insun Shin,Daeil Kwon 국제구조공학회 2018 Smart Structures and Systems, An International Jou Vol.22 No.2
Digital input and output modules are widely used to connect digital sensors and actuators to automation systems. Digital I/O modules provide flexible connectivity extension to numerous sensors and actuators and protect systems from high voltages and currents by isolation. Components in digital I/O modules are inevitably affected by operating and environmental conditions, such as high voltage, high current, high temperature, and temperature cycling. Because digital I/O modules transfer signals or isolate the systems from unexpected voltage and current transients, their failures may result in signal transmission failures and damages to sensitive circuitry leading to system malfunction and system shutdown. In this study, the lifetime of optocouplers, one of the critical components in digital I/O modules, was predicted using Bayesian tracking approaches. Accelerated degradation tests were conducted for collecting the critical performance parameter of optocouplers, current transfer ratio (CTR), during their lifetime. Bayesian tracking approaches, including extended Kalman filter and particle filter, were applied to predict the failure. The performance of each prognostic algorithm was then compared using accuracy and robustness-based performance metrics.
Service Life Estimation of Supercomputing Systems based on Low-power Processors
Insun Shin,Juyoung Park,Daeil Kwon 한국정보통신학회 2016 2016 INTERNATIONAL CONFERENCE Vol.8 No.1
Supercomputing centers have been paying expenses mainly for massive energy consumption required for supercomputer management. Energy consumption is expected to increase with continuous growth of supercomputer use in the future. Low-power processor based supercomputers have been considered as an alternative that can reduce the energy consumption. It was reported that the use of low-power processors in a supercomputer could reduce about 10% of the total energy consumption of a supercomputing center. While many researchers have been endeavored to investigate the advantages of low-power processor use in supercomputing systems, there are limited number of studies examining their service life in the field. In fact, low power processors in a supercomputer should be susceptible to thermo-mechanical and electrical stresses due to their exposure to harsh use conditions compared to their intended conditions, i.e. mobile device applications. These stresses can result in physical failure of low power processors, malfunction of supercomputers, and eventually reduction of supercomputer service life. This paper focuses on estimating the service life of supercomputing systems based on low-power processors.
Shin, Insun,Kwon, Daeil Techno-Press 2018 Smart Structures and Systems, An International Jou Vol.22 No.2
Digital input and output modules are widely used to connect digital sensors and actuators to automation systems. Digital I/O modules provide flexible connectivity extension to numerous sensors and actuators and protect systems from high voltages and currents by isolation. Components in digital I/O modules are inevitably affected by operating and environmental conditions, such as high voltage, high current, high temperature, and temperature cycling. Because digital I/O modules transfer signals or isolate the systems from unexpected voltage and current transients, their failures may result in signal transmission failures and damages to sensitive circuitry leading to system malfunction and system shutdown. In this study, the lifetime of optocouplers, one of the critical components in digital I/O modules, was predicted using Bayesian tracking approaches. Accelerated degradation tests were conducted for collecting the critical performance parameter of optocouplers, current transfer ratio (CTR), during their lifetime. Bayesian tracking approaches, including extended Kalman filter and particle filter, were applied to predict the failure. The performance of each prognostic algorithm was then compared using accuracy and robustness-based performance metrics.
DC sputter방식으로 제조된 Cu<sub>2</sub>Se 박막의 전자빔 처리에 따른 특성 연구
권혁(Kwon, Hyuk),김재웅(Kim, ChaeWoong),정승철(Jung, SeungChul),김동진(Kim, DongJin),박인선(Park, InSun),정채환(Jeong, ChaeHwan) 한국신재생에너지학회 2011 한국신재생에너지학회 학술대회논문집 Vol.2011 No.11
현재 태양전지시장에서 비중이 많은 실리콘 태양전지는 높은 효율에 비해 제조 단가가 비싸다는 단점을 가지고 있다. 이에 비해 칼코파라이트 구조의 CuInSe₂ (CIS)계 화합물은 직접 천이형 반도체로서 높은 광흡수 계수(1{times}105cm-{acute{e}1)와 밴드갭 조절의 용이성 및 열적 안정성 등으로 인해 고효율 박막 태양전지용 광흡수층 재료로 많은 관심을 끌고 있다. CIS 계 물질에 속하는 Cu(InGa)Se₂ (CIGS) 태양전지의 경우 양산화에 sputtering방식사용하고 Showa Shell에서는 대면적 CIGS 모듈 효율 13.4%를 달성한 바 있다. 현재 CIGS는 열처리하는 방법으로 selenization 공정을 사용하는데 이 공정은 유독한 H₂Se gas를 이용해야 한다는 점과 긴 시간 동안 열처리를 해야 하는 단점을 가지고 있다. 따라서 이러한 단점을 보완하기 위해 본 연구에서는 전자빔을 사용하여 후속 공정을 실시하였다. 전자빔을 사용할 경우 낮은 온도에서 precursor를 처리하며 짧은 시간에 공정이 끝난다는 장점이 있다. 본 연구에서는 sodalime glass위에 조성비(Cu 60.87% Se 38.66%)인 Cu₂Se target(4.002{times}0.123) 을 DC sputter를 이용하여 DC power를 50W,100W를 주고 Working pressure를 20,15,10,5,3,1mtorr로 조절하여 증착하였다. 전자빔의 세기 조건을 3Kv, Rf power 200W, Ar 7sccm로 전자빔 조사 시간을 1,2,3,4,5min으로 늘려가며 최적화 실험 하였고 최적화된 조건으로 Cu₂Se target에 조사 하였다. 박막의 특성평가는 전자빔 조사 전/후에 대해 XRD, SEM, XRF, Hall measurement, UV-VIS을 이용하여 분석평가를 하였다. 이 실험은 Cu₂Se상이 자라는 특성과 표면 상태에 따라 CIGS박막을 증착하였을 때 나타나는 효율 변화를 알아 보기위한 초기 공정 실험이다.
제 7차 수학 교육과정에 따른 수학과 문제 중심 학습 자료 개발 연구
신인선,권점례 한국수학교육학회 2003 수학교육 Vol.42 No.3
Problem-centered learning has many implications on teaching and learning mathematics. Students devise their solutions to solve problems and participate in the discussion with teacher and other students to share and justify their solution during the problem-centered learning. Therefore, we purposed to provide problem-centered learning materials to be able to use in teaching and learning the 7th mathematics curriculum in this study. First, we reviewed the 7th curriculum and its textbooks to know what and how students learn and suggested the problem-centered learning as a teaching method to perform the 7th curriculum. Next, we developed the problem-centered learning materials for 6th grade in elementary school and taught students with these materials to amend errors. Finally, we developed evaluation criteria to evaluate students while they learned mathematics in the problem-centered learning.
전자패키지 신뢰성 예측을 위한 최적 구간중도절단 시험 설계
권대일,신인선,Kwon, Daeil,Shin, Insun 한국마이크로전자및패키징학회 2015 마이크로전자 및 패키징학회지 Vol.22 No.2
Qualification includes all activities to demonstrate that a product meets and exceeds the reliability goals. Manufacturers need to spend time and resources for the qualification processes under the pressure of reducing time to market, as well as offering a competitive price. Failure to qualify a product could result in economic loss such as warranty and recall claims and the manufacturer could lose the reputation in the market. In order to provide valid and reliable qualification results, manufacturers are required to make extra effort based on the operational and environmental characteristics of the product. This paper discusses optimal interval censoring design for reliability prediction of electronic packages under limited time and resources. This design should provide more accurate assessment of package capability and thus deliver better reliability prediction.