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High Frequency Dielectric Mapping Using Un-Contact Probe for Dielectric Materials
Kakemoto, Hirofumi,Nam, Song Min,Wada, Satoshi,Tsurumi, Takaaki Trans Tech Publications, Ltd. 2006 Key Engineering Materials Vol.320 No.-
<P>The microwave reflection intensity was measured at room temperature for Cu-plate, Al2O3 and SrTiO3 single crystals using a un-contact probe as a function of distance between sample and probe. The difference of reflection intensity for Cu-plate, Al2O3 and SrTiO3 single crystals was observed in the region where the distance of 0.2mm between sample and probe, and it was caused from dielectric permittivities of samples. The reflection coefficient of sample was estimated in comparison with results of electromagnetic simulation using finite differential time domain method. The reflection intensity for Cu-plate, Al2O3 and SrTiO3 single crystals was transformed to dielectric permittivity at reflection intensity minimum point. The dielectric permittivity mapping was also examined at reflection intensity minimum point.</P>
Li, Jianyong,Kakemoto, Hirofumi,Wada, Satoshi,Tsurumi, Takaaki Trans Tech Publications, Ltd. 2006 Key Engineering Materials Vol.301 No.-
<P>A new measuring method and analyzing procedure were proposed to determine the complex dielectric permittivity of materials with relatively high permittivity using an RF-impedance analyzer. Samples used for the measurement were (Ba0.6Sr0.4)TiO3 and Ba(Zr0.25Ti0.75)O3 ceramics. Micro planar electrodes were used for the measurement of complex admittance of these samples. Electromagnetic simulations were carried out for determining the relative dielectric permittivity and dielectric loss. The complex dielectric permittivity vs. frequency curves of Ba(Zr0.25Ti0.75)O3 showed a broad dielectric relaxation, while that of (Ba0.6Sr0.4)TiO3 was almost flat up to 3 GHz.</P>
Tsurumi, Takaaki,Nam, Song-Min,Mori, Naoko,Kakemoto, Hirofumi,Wada, Satoshi,Akedo, Jun The Korean Ceramic Society 2003 한국세라믹학회지 Vol.40 No.8
The Aerosol Deposition (AD) process will be proposed as a new fabrication technology for the integrated RF modules. $\alpha$-A1$_2$O$_3$ thick films were successfully grown on glass and Al substrates at room temperature by the AD process. Relative dielectric permittivity and loss tangent of the $Al_2$O$_3$ thick films on Al showed 9.5 and 0.005, respectively. To form microstrip lines on aerosol-deposited A1903 thick films, copper electroplating and lithography processes were employed, and the square-type cross section with sharp edges could be obtained. Low-pass LC filters with 10 GHz cutoff frequency were simulated by an electromagnetic analysis, exhibiting the validity of the AD process as a fabrication technology f3r integrated RF modules.
Fabrication of Microstrip Band Pass Filters in GHz Region by Aerosol Deposition Process
Momotani, Mihoko,Mori, Naoko,Nam, Song Min,Kakemoto, Hirofumi,Wada, Satoshi,Tsurumi, Takaaki,Akedo, Jun Trans Tech Publications, Ltd. 2006 Key Engineering Materials Vol.301 No.-
<P>In order to fabricate a microstrip band pass filter in GHz region as a passive component of RF modules, Al2O3 thick films were prepared on Cu metal substrates by AD (Aerosol Deposition) process. The dimensions of the filters were determined by the high frequency electromagnetic analysis. The filters were successfully fabricated on AD-derived Al2O3 thick films by employing sputtering, photolithography, electroplating and chemical etching processes. Their filtering characteristics were examined by a Network Analyzer. Through this work, we suggest that the AD process will be important the fabrication technology for integrated RF modules.</P>
Aerosol Deposition Process for Ceramic Thick Film Formation
Tsurumi Takaaki,Akedo Jun,Sekine Takashi,Momotani Nohoko,Kakemoto Hirofumi,Wada Satoshi 한국분말야금학회 2006 한국분말야금학회 학술대회논문집 Vol.2006 No.1
The 21st Century Frontier Program, which is one of the R&D programs funded by Korean government, was launched in 1999 to elevate the status of Korean science and engineering capabilities to the advanced nation in the strategic fields. Currently, 23 different fields of science and engineering programs are carried out by researchers in institutes, universities and industries. Center for Advanced Materials Processing (CAMP) was formulated in 2001 to develop the advanced materials as well as to improve the parts manufacturing process. The main role of CAMP is proposing and forecasting the long term vision in Materials Processing Technology and also supporting the project teams for their best performance in R&D. The CAMP program consists of 5 research areas such as, Multi-layer Ceramic Electronic Parts, Powder Formed Precision Parts, 3 Dimensional Polymer Based Composites, Functional Metal Sheets, Parts Integration Technology. An introduction of R & D activities at CAMP, specially focusing on powder metallurgy, wil be presented.