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Influences of the Electroless Nickel Film Condition on the Electroless Au/Pd/Ni Wire Bondability
Ikuhiro KATO,Tomohito Kato,Hajime Terashima,Hideto Watanabe,Hideo Honma 한국표면공학회 2010 한국표면공학회 학술발표회 초록집 Vol.2010 No.11
Electroless Au/Ni plating process is intensively applies to high density printed boards. In this process, the local corrosion is often occurred between the deposited nickel and the deposited gold. Generally, nickel is tends to diffuse from the local corroded areas to the deposited gold surface due to the strong affinity of oxygen after thermal treatment. These areas cause the surface mounting failure. Recently, electroless Au/Pd/Ni plating process is studied actively as the substitution of electroless Au/Ni plating process because of suppressing the nickel corrosion reaction. The wire bonding strength is increased with increasing the palladium and gold film thickness. However, thin gold, palladium films are required to the electronics devices for cost reduction. In this study, we investigated the influence of nickel microstructure for the wire bondability. The deposited nickel microstructures are also influenced the wire bonding properties after thermal treatment. It was confirmed that the good wire bondability can be achieved by using nickel film with layered microstructure than the columnared microstructure. From the AES analysis, we confirmed that preparation of uniform layered microstructure of nickel film is key factor to keep the fold concentration of the gold film surface after thermal treatment