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A study on the ergonomic aspects of the proper luminance level of displays
Lee, Eunjung,Kim, Sangho,Park, HyeRyoung,Bae, Jaewoo,Lee, Seungbae,Kim, Haksun The Korean Infomation Display Society 2012 Journal of information display Vol.13 No.4
In this paper, a display's emotional image quality can be primarily determined by designing the proper luminance level. Though displays with high luminance are preferred, too much light emission from a display may cause glare or visual fatigue to viewers. To find out the proper luminance level based on various video contents, this study was conducted with an OLED display with a real-black level and a wide color gamut, and with an LCD display with a high luminance level, to set the glare threshold under various conditions. The optimum luminance levels according to the display's loading ratio were found, and the maximum luminance that did not cause a glare in the test is proposed.
Characterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications
Haksun Lee,Yong-Sung Eom,Hyun-Cheol Bae,Kwang-Seong Choi,Jin Ho Lee IEEE 2014 IEEE transactions on components, packaging, and ma Vol.4 No.10
<P>Popular solder-bumping mechanisms such as electroplating and stencil printing suffer from either high process costs or technical limitations. A low-cost solder-on-pad (SoP) process has been developed to meet the requirements of fine-pitch solder bumping. This paper focuses on the characterization and estimation of the SoP process. To form a solder bump without soldering defects, optimum process conditions should be carefully designed. A model to estimate the bump volume and predict the bump height is suggested. By optimizing the composition of solder paste material called solder-bump-maker, and by adjusting the process conditions, Sn-Ag-Cu solder bumps with different heights are obtained. The experiments and analysis to understand the impact of parameters were based on test vehicles with 80 μm pitch size. Then, the measured heights of solder bumps are compared with the model to see how they fit the estimation. Finally, a similar process has been conducted to test vehicles with pitch sizes of 150 and 40 μm, to confirm the scalability of the SoP process in different pitch sizes.</P>
이학선(Lee Haksun),박채영(Park Chae-Young),조래혁(Cho Rae-Hyuck),김만철(Kim Man-Cheol),이희성(Lee Hee-Sung) 한국철도학회 2009 한국철도학회 학술발표대회논문집 Vol.2009 No.11월
Railway is used more than other public transportation since it has good punctuality and safety and securing safety is of importance as it is a mass transportation. But, train derailment due to the broken rail as a factor obstructing the safety of trains. Since a minute defect(crack) is often changed to breaking of the rail , we can identify the condition of occupation of trains by the detection of track shunt in existing fixed block track circuit when broken rail occurs. However, since recent CBTC(Communication Based on Train Control) systems is moving block trackless , it is impossible to detect broken rail. Thus, this paper examined domestic and abroad methods of detecting broken rail , developed and tested a monitoring system for rail breaks using optical fiber method, and proved it didn't have any problems to be applied to the field of railway.
Jeongyun Lee,Wanjae Park,Haksun Lee,Tokasiki Ken,Dong Hwan Kim,Kyoungsub Shin,Ilsub Chung 한국물리학회 2009 THE JOURNAL OF THE KOREAN PHYSICAL SOCIETY Vol.55 No.1
The distortion of the capacitance-voltage curve and the threshold voltage change caused by tunnel oxide degradation in connection with metal pad etch-induced plasma damage was investigated in 0.04 μm flash memory technology. The metal pad etch, as a final plasma process of IC fabrication contain cumulative plasma process-induced damage (P2ID). However, no metal pad etch-induced plasma damage, such as gate threshold voltage (Vth) change and hot temperature stress, has yet been reported because it is difficult to accurately analyze regardless of the previous processes. Therefore, to clearly analyze the P2ID on a metal pad, test element group (TEG) module to measure the interface traps (Nit) with a charge-pumping method and a simple-plasma-damage-monitor (SPDM) created to replace CHARM2. Consequently, we showed that the P2ID was correlated with the position of the chips or the etch rate uniformity map as a result of the plasma non-uniformity in each plasma etcher and the plasma condition. The distortion of the capacitance-voltage curve and the threshold voltage change caused by tunnel oxide degradation in connection with metal pad etch-induced plasma damage was investigated in 0.04 μm flash memory technology. The metal pad etch, as a final plasma process of IC fabrication contain cumulative plasma process-induced damage (P2ID). However, no metal pad etch-induced plasma damage, such as gate threshold voltage (Vth) change and hot temperature stress, has yet been reported because it is difficult to accurately analyze regardless of the previous processes. Therefore, to clearly analyze the P2ID on a metal pad, test element group (TEG) module to measure the interface traps (Nit) with a charge-pumping method and a simple-plasma-damage-monitor (SPDM) created to replace CHARM2. Consequently, we showed that the P2ID was correlated with the position of the chips or the etch rate uniformity map as a result of the plasma non-uniformity in each plasma etcher and the plasma condition.
오진우(JinWoo Oh),이장현(JangHyun Lee),김학선(HakSun Kim),이정호(JungHo Lee),이수혁(SooHyuk Lee),김한샘(HanSam Kim) 한국소음진동공학회 2015 한국소음진동공학회 학술대회논문집 Vol.2015 No.10
Various absorber is used in the noise reduction equipments and acoustic construction site. Representative absorbers are Glass-wool and Poly-ester. Both of them has a high absorption coefficient. When the absorber is installed, absorber is needed finishing, perforated plate and film, to maintain the shape, prevent scatter and keep from water. These finishing layer cause shift of the absorption coefficient. Experiment was performed at acoustic facility(reverberant room) by referring KS I ISO 2805 standard.