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Lee, Hyosang,Cho, Haedo,Kim, Sangjoon J,Kim, Yeongjin,Kim, Jung Institute of Physics Publishing 2018 Smart materials & structures Vol.27 No.2
<P>Recently, piezo-resistive nanocomposites have emerged as an important smart material for realizing less obtrusive and more comfortable stretch sensing applications. To manufacture cost-effective and skin-mountable stretch sensor, dispenser printing is advantageous method because piezo-resistive nanocomposites can be directly printed on a woven elastic fabric in various patterns. However, both electrical and mechanical properties of the nanocomposites need to be modulated to achieve favorable sensing performance as well as strong adhesion between the nanocomposite and the fabric to sustain large strains. Moreover, inherent hysteretic behavior of the soft nanocomposite should be compensated to obtain consistent stretch sensing. This paper presents silicone rubber mixed with long multi-walled carbon nanotubes (Long-MWCNTs) composites as a piezo-resistive transducing material for dispenser printing. High aspect ratio of the Long-MWCNTs resulted in low viscosity of a liquid state nanocomposite and high electrical conductivity. Due to the low viscosity, the liquid state nanocomposite could permeate into gaps of the woven elastic fabrics and ensured strong bonding force in large strains up to 35%. In addition, a modified Prandtl-Ishilinskii (MPI) model was adopted to compensate for piezo-resistive hysteresis of the nanocomposite. For validation, the skin-mountable sensor was applied to estimate rotation angle of a wrist. The sensor system estimated the rotation angle of the wrist with an estimation error of 1.93 degrees within 65 degrees range (2.9%) for the step increment and decrement test, and 7.15 degrees within 75 degrees range (9.5%) for the arbitrary movement test. Thus, the experimental results show that the dispenser printing method incorporated with hysteresis compensation can provide a guideline to implement skin-mountable smart fabrics for stretch sensing using various nanocomposites</P>
리튬 니오베이트(LiNbO₃) 웨이퍼의 CMP에 관한 연구
조한철(Hanchul Cho),정석훈(Sukhoon Jeong),이호준(Hojun Lee),박재홍(Jaehong Park),김형재(Hyoungjae Kim),정해도(Haedo Jeong) 한국기계가공학회 2007 한국기계가공학회 춘추계학술대회 논문집 Vol.2007 No.-
Lithium niobate (LiNbO₃) crystal is a kind of brittle and high hardness material. Lithium niobate is ferroelectric that has piezoelectric and pyroelectric characteristic. Because of these characteristics, lithium niobate is used in many electron components and parts. However, it is easily damaged during machining, and difficult to obtain high quality surface. In oder to obtain high MRR (material removal rate) and high quality surface roughness, lithium niobate polishing process applied to CMP (chemical mechanical polishing) process which is consisted of chemical and mechanical effects. In these experiments, two type pads closed-cell type pad (IC 1400 K-groove pad) and opened-cell type pad (Suba 800 M2 pad) and slurry of fumed silica type (ILD 1300 slurry) were used in same velocity and pressure conditions. Nano-view was used to measure surface roughness of the wafer.
리튬탄탈레이트(LiTaO₃) 기판의 화학기계적 연마 기술
이현섭(Hyunseop Lee),조한철(Hanchul Cho),정해도(Haedo Jeong) 대한기계학회 2008 대한기계학회 춘추학술대회 Vol.2008 No.5
Recently, lithium tantalate (LiTaO₃, LT) has been widely used for a piezoelectric material for SAW components and optical waveguides because of its piezoelectric, electro-optical, nonlinear optical characteristics, and a wide transparency range from ultraviolet to infrared. LT wafers should be polished to be used for substrates of device and waveguides due to surface scattering. However, few researchers have been reported on the chemical mechanical polishing (CMP) of LT. In this paper, we investigated the characteristics of potassium hydroxide (KOH)-hydrogen peroxide (H₂O₂) based slurry in CMP of LT by using modification of KOH based CMP slurry.
김영민(Young-min Kim),조한철(Han-chul Cho),정해도(Haedo Jeong) 대한기계학회 2008 대한기계학회 춘추학술대회 Vol.2008 No.11
Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and te cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-step CMP consists of Cu CMP and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the buffing is performed various conditions as a cleaning process. The buffing process combined mechanical cleaning by friction between a wafer and a buffing pad and chemical cleaning by buffing solution consists of tetramethyl ammonium hydroxide(TMAH)/benzotriazole(BTA)
구리 CMP 후 연마입자 제거에 화학 기계적 세정의 효과
김영민(Young-min Kim),조한철(Han-chul Cho),정해도(Haedo Jeong) 대한기계학회 2009 大韓機械學會論文集A Vol.33 No.10
Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-step CMP consists of Cu and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the chemical mechanical cleaning(CMC) is performed various conditions as a cleaning process. The CMC process combined mechanical cleaning by friction between a wafer and a pad and chemical cleaning by CMC solution consists of tetramethyl ammonium hydroxide (TMAH) / benzotriazole (BTA). This paper studies the removal of abrasive on the Cu wafer and the cleaning efficiency of CMC process.