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Scanning Tunneling Microscope(STM)의 제작
김동식,정회환,정관수 慶熙大學校 材料科學技術硏究所 1993 材料科學技術硏究論集 Vol.6 No.-
In this paper, we have designed and constructed a scanning tunneling microscope(STM) for studying on the atomic scale strucure of semiconductor surfaces We considered next four points. Firstly, we used triple spring damping system for stable measurement. Secondly, we soldered electronic part on PCB board to minimize electronic noise. Thirdly, we made stable power supply part to reduce drift power noise. Fourthly, stainless steel 302 was used for future UHV experiment. In operating the STM, we could eliminate the effect of external vibration by adopting the triple spring damping system. Noise of 60 Hz which was generated by wire connection between electronic and mechanical part, was eliminated by drying the silver paste thoroughly. Tip voltage was biased by 10mV We have obtained clear images of HOPG(high oriented pyrolitic graphite) when tunneling current was 2nA. In conclusion, we have confirmed that our STM have a resolution of atomic scale by investigation of the image of HOPG surface.
변형률 측정을 이용한 추진기관용 Al 합금의 파괴인성 평가
김재훈,김덕회,임동규,박성욱,문순일 한국산업안전학회 2002 한국안전학회지 Vol.17 No.3
The fracture toughness is evaluated by using CT(compact tension) and 3PB(thress point bending) specimens of A1 alloys for propulsive engine. To evaluate the static fracture toughness, strain gage method is used. The static fracture toughness obtained from the strain measurement is compared with the results by ASTM standard and FEM analysis. For the reliable evaluation of fracture toughness, strain gages are attached at various positions.