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Recent Progress in Electroless Plating of Copper
Sharma, Ashutosh,Cheon, Chu-Seon,Jung, Jae Pil The Korean Microelectronics and Packaging Society 2016 마이크로전자 및 패키징학회지 Vol.23 No.4
In this article, the recent developments in electroless plating of copper, electroless bath formulation and effect of plating parameters have been reviewed. Cyanide free electroless baths are now being developed and studied due to the various environmental concerns. Various organic chemicals such as complexing agents, reducing agents, and additives such as poly-alcohols and aromatic ring compounds have been added to copper plating baths for promising results. The effects of various reducing and complexing agents, bath conditions like additives, bath pH, and composition have been summarized. Finally the applications of the electroless plating of copper and latest developments have been overviewed for further guidance in this field.
Flip Chip Bump Formation of Sn–1.8Bi–0.8Cu–0.6In Solder by Stencil Printing
Lee, Jaesik,Jung, Jae-Pil,Cheon, Chu-Seon,Zhou, Yunhong,Mayer, Michael The Japan Institute of Metals 2005 Materials transactions Vol.46 No.11
<P>Flip chip bumping by stencil printing method using a new composition of solder paste, Sn–1.8%Bi–0.8%Cu–0.6%In, all in mass%, was investigated. Sn–3.5%Ag, Sn–37%Pb and Sn–36%Pb–2%Ag were selected as references for the experiment. The solder pastes were printed on the under bump metallization (UBM) of a Si-wafer using a stencil, where diameter and thickness of the stencil opening were 400 and 150 μm, respectively. The UBM deposit comprised 0.4 μm each of Al, Ni and Cu, and 20 nm of Au from bottom to top of the metallization, sequentially. The printed paste bumps were reflow soldered in air, and the peak soldering temperature of Sn–1.7Bi–0.8Cu–0.6In and Sn–3.5Ag was 523 K and of Sn–37Pb and Sn–36Pb–2Ag was 503 K. From the experimental results the solder bumps of Sn–1.8Bi–0.8Cu–0.6In alloys were well-formed with a mean height of 260 μm. The shear strength of Sn–1.8Bi–0.8Cu–0.6In at 523 K (as-reflowed) showed the highest value of 6.5N followed by those of Sn–3.5Ag, Sn–37Pb and Sn–36Pb–2Ag solders. After 1000 h aging, while the shear strength of the Sn–1.8Bi–0.8Cu–0.6In showed 27% decrease compared to as-reflowed conditions, it was still 15–30% higher than those of Sn–37Pb, Sn–36Pb–2Ag and Sn–3.5Ag solders. Intermetallic compounds (IMCs) formed on the interface between solder and UBM were (Cu,Ni)<SUB>6</SUB>Sn<SUB>5</SUB>. As aging time went on up to 1000 h, the content of Ni in the IMC changed from 6.6% at initial stage (as-reflowed) to 13.5% at final stage (1000 h aging).</P>
Sn-1.7Bi-0.7Cu-0.6In 솔더의 특성 연구
박지호,이희열,전지헌,전주선,정재필,Park, Ji-Ho,Lee, Hee-Yul,Jhun, Ji-Heon,Cheon, Chu-Seon,Jung, Jae-Pil 대한용접접합학회 2008 대한용접·접합학회지 Vol.26 No.5
Characteristics of Sn-1.7%Bi-0.7%Cu-0.6%In (hereafter, SBIC) lead-free solder was investigated in this study. The results from SBIC were compared to other lead-free solders such as Sn-3.5%Ag-0.7%Cu (hereafter, SAC), Sn-0.7%Cu (hereafter, SC), and lead-bearing Sn-37%Pb (hereafter, SP) alloy. Tensile properties of bulk solder, wettability, spreading index, bridge and dross were evaluated. As experimental results, tensile strength and elongation of SBIC was 62.5MPa and 21.5%, respectively. The tensile strength was comparable to that of SP solder. The wetting time of SBIC was 1.2 sec at $250^{\circ}C$, and its wetting properties including wetting force were as good as the SAC alloy. However, wettability of the SC was not so good as the SBIC and SAC. The spreading index of SBIC at $250^{\circ}C$ was 71 %, and it was similar level to those of SAC and SC solders. Bridging was not found for all solders of SBIC, SAC and SC in the range from 240 to $260^{\circ}C$. In dross test at $250^{\circ}C$ for an hour, the amount of dross produced from SBIC was about 57% compared to that from SAC.
스텐실 프린트법으로 인쇄한 Sn-1.8Bi-0.7Cu-0.6In 솔더의 고온 시효 특성
이재식,조선연,이영우,김규석,전주선,정재필,Lee Jaesik,Cho Sun-Yun,Lee Young-Woo,Kim Kyoo-Suk,Cheon Chu-Seon,Jung Jae-Pil 한국마이크로전자및패키징학회 2005 마이크로전자 및 패키징학회지 Vol.12 No.4
새로 개발된 Sn-1.8Bi-0.7Cu-0.6In 솔더의 리플로우 후 고온시효 특성을 전당강도 및 미세구조 분석을 통하여 평가하였다. 범프 형성을 위하여 스텐실 프린트법을 사용하였다. Sn-1.8Bi-0.7Cu-0.6In 솔더의 전단강도가 초기 및 고온시효 후에도 가장 높았고, 생성된 계면 금속간화합물은 리플로우 초기뿐만 아니라 시효 후 동일 하게 $(Cu,\;Ni)_6Sn_5$가 형성되었다. 또한, 500시간 시효 이전에 솔더의 분리 현상이 관찰되었다. Aging characteristics of newly developed Sn-1.8Bi-0.7Cu-0.6In solder was evaluated by shear strength and microstructure. Stencil printing was applied to form solder. The shear strength of Sn-1.8Bi-0.7Cu-0.6In at $150^{\circ}C$ showed the highest values through aging. Intermetallic compounds formed on the interface between solder and Au/Cu/Ni/Al UBM were $(Cu,\;Ni)_6Sn_5$ Furthermore, it was found that Spatting of Intermetallic compounds started before 500h aging at $150^{\circ}C$.