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      저자 : Bishnu Prasad Panda (검색결과 1 건)
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        Thermokinetics behavior of epoxy adhesive reinforced with low viscous aliphatic reactive diluent and nano-fillers

        Amit Kumar Singh,Bishnu Prasad Panda,Smita Mohanty,Sanjay Kumar Nayak,Manoj Kumar Gupta 한국화학공학회 2017 Korean Journal of Chemical Engineering Vol.34 No.11

        The current study reports the effect of low viscous aliphatic reactive diluent (RD), MWCNT and VGCF on the curing kinetics of amine cured epoxy adhesive system employing non-isothermal differential scanning calorimetric (DSC) technique. Non-isothermal DSC thermograms of epoxy adhesive were studied at various heating rates: 5, 10 and 15 oC/min. The decrease in the exothermic peak height with the introduction of MWCNTs and VGCFs was taken as proof of the acceleration effect of nano-fillers on the epoxy-amine curing reaction. Also, increased Tonset, TP and ΔHcurs values were observed for epoxy/RD adhesive system at all heating rates. The value of activation energy (Ea) was determined using Kissinger and Flynn-Wall-Ozawa methods. Experimental results showed that the addition of 10 wt% RD increased the Ea from 60 to 63 kJ/mol on account of the reduced viscosity, allowing better contact of resin with the curing agent. Furthermore, MWCNTs have an accelerating effect on the cure kinetics that does not change the autocatalytic cure reaction mechanism of epoxy resin. It was also found that the addition of MWCNT and VGCF decreases the overall degree of conversion, as evident with lower ΔHcure and Ea of the cured adhesive when compared with epoxy/RD system. The dependency of Ea on degree of conversion ranging from α =0.1 to 0.9was also investigated. The two normalized functions y(α) and z(α) were also considered in order to study the complex curing mechanism. The kinetic parameters m, n and lnA were obtained by using two parameter autocatalytic Sestak-Berggren model. The curves revealed good agreement between experimentally determined and theoretically obtained MWCNT/VGCF reinforced epoxy adhesive systems.

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