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So-Hee Hyun(현소희),Mi-Song Kim(김미송),Won Sik Hong(홍원식),Jae-Hyung Lee(이재형),Tae-Jong Lee(이태종) 대한용접·접합학회 2024 대한용접·접합학회지 Vol.42 No.5
Cantilever wire probe card has limited to transport high-speed signal because of long wire but it is suitable for inspecting high-current and high voltage semiconductor such as wide band gap (WBG) power semiconductors. Superior mechanical property of a probe card wire is in demand because it is respectively used wafer inspection with in and out pad on the top surface of the power semiconductor wafer. Therefore, in this study, tensile specimens of micro electro-mechanical systems (MEMS) probe alternatively layered and electroplated with palladium (Pd)-cobalt (Co) alloy layers and copper (Cu) layers. MEMS probe was also measured tensile strength and elongation with multilamination and heat treatment conditions. Additionally, fractography of fracture surface after tensile test were analyzed using a scanning electron microscope (SEM). As the number of PdCo-Cu multi-layer increased, 11, 15 and 21 layered specimens showed higher tensile strength and longer elongation than 5 layered specimens because of the increase of laminated interface of PdCo and Cu. 7 layered specimen after isothermal aging had higher tensile strength and longer elongation than before isothermal aging. In 5, 11, 15 and 21 layered specimens, the fracture surfaces of tensile test specimens without aging treatment showed a ductile-brittle mixed fracture mode. Fracture surfaces of 7-layered specimen before and after isothermal aging showed a ductile-brittle mixed fracture mode.
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이예림,소희진,장윤환,조수연,백대현,임경아,현정원,한규섭,강혜진 대한수혈학회 2011 大韓輸血學會誌 Vol.22 No.1
There have been 5 case reports about immune hemolytic anemia related with cimetidine, but there has been no such report in Korea. A sixty-four-year-old woman was admitted to the emergency department in a coma. She was diagnosed with diffuse large B-cell lymphoma 5 years ago and she achieved a complete remission after treatment. She was in a state of shock, and her blood pressure was 70/40 mmHg. The laboratory test results were consistent with hemolytic anemia (HA) as follows: hemoglobin: 1.9 g/dL, corrected reticulocyte count: 2%, total/conjugated bilirubin: 6.4/2.1 mg/dL, lactate dehydrogenase: 1,083 U/L and haptoglobin <10mg/dL. She had a history of taking the drugs including cimetidine, acetaminophen and etizolam for two days. She urgently received transfusion of 3 units of packed red blood cells and then she regained consciousness. To investigate the relation between cimetidine and HA, we subsequently performed a drug-induced immune complex test and an antibody test by using cimetidine, AB serum and phosphate-buffered saline. The results proved that cimetidine was the cause of the HA. Patient was treated with steroid, and the following laboratory tests showed rapid improvement. This is the first case report from Korea that shows the causal relationship between cimetidine and immune HA.
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150 ㎛ 높이 구리기둥 적용 패키지-온-패키지 적층 접합 특성
김미송,현소희,배주영,홍원식 대한용접접합학회 2024 대한용접·접합학회지 Vol.42 No.4
In this study, we used copper (Cu) posts, plated to a height of 150 μm, as interconnections to form electrodes between different package layers. The upper layer consisted of a chip-scale package (CSP), while the lower layer was made up of a flip chip-chip scale package (FCCSP). We plated a Cu post on the side of FCCSP substrate, and produced the FCCSP package by thermo-compression (TC) bonding with copper pillar solder bumps on the center of substrate. The surface of the bottom electrode for the upper CSP received a surface finish of electroless nickel, electroless palladium, and immersion gold (ENEPIG). The bonding surface of the lower FCCSP was the bare Cu surface of the epoxy-molded Cu post. The PoP joining process used a vacuum reflow process with solder paste and solder balls. To understand the package joint's characteristics, we measured voids and shear strength, and analyzed the cross-sectional microstructure. The temperature profile used in the PoP joining process demonstrated optimal joint characteristics with a joint void content of 2.3% and a joint strength of approximately 44 MPa when formic acid was utilized and the activation preheating time was extended. Cross-sectional warpage analysis of the PoP package revealed a minimal difference of approximately 31 μm between the center and the ends. This study successfully developed a stacked package with a PoP structure using Cu Post, and the bonding process was optimized to minimize warpage in the PoP package.
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