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자동차 크로스멤버 하판넬 제작용 금형 설계를 위한 스프링백 해석
장성호(Sungho Chang),허영무(Youngmoo Heo),신광호(Kwangho Shin),전용준(Yongjun Jeon) 한국자동차공학회 2010 한국자동차공학회 부문종합 학술대회 Vol.2010 No.5
In this study, the drawing process simulation and springback analysis through using PAM-STAMP, a commercial FEM code were conducted for the lower pannel of Rear cross-member in the sub-frame as a automobile part. And the predicted springback results were compared and checked with the CAD data of the product and the CMM data for the prototype product. As a stamping analysis results, a wrinkling problem was occurred in the side-wall of the lower pannel. As a solution for this wrinkling problem, it was recommanded that two drawing steps, which are 1st stamping and restriking process, is needed. And then as a springback analysis results, the result of deformed shape after springback compared with the CMM data for the prototype product was a little bit different as a quentity, but the springback trend is similar.
PDMS 쿠션을 갖는 Si 몰드에 의한 핫엠보싱 공정에서의 4인치 웨이퍼 스케일 전사성 향상
김흥규(Heung-Kyu Kim),고영배(Young Bae Ko),강정진(Jeong Jin Kang),허영무(Youngmoo Heo) Korean Society for Precision Engineering 2006 한국정밀공학회지 Vol.23 No.8
Hot embossing is to fabricate desired pattern on the polymer substrate by pressing the patterned mold against the substrate which is heated above the glass transition temperature, and it is a high throughput fabrication method for bio chip, optical microstructure, etc. due to the simultaneous large area patterning. However, the bad pattern fidelity in large area patterning is one of the obstacles to applying the hot embossing technology for mass production. In the present study, POMS pad was used as a cushion on the backside of the micro-patterned 4 inch Si mold to improve the pattern fidelity over the 4 inch PMMA sheet by increasing the conformal contact between the Si mold and the PMMA sheet. The pattern replicability improvement over 4 inch wafer scale was evaluated by comparing the replicated pattern height and depth for POMS-cushioned Si mold against the rigid Si mold without POMS cushion.