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SiC Fiber 강화 다공질 반응 소결 탄화규소 Composite의 제조 및 기계적 특성
한재호,박상환,Han, Jae-Ho,Park, Sang-Whan 한국세라믹학회 2006 한국세라믹학회지 Vol.43 No.8
In this study, chopped Hi-Nicalon SiC fiber Reinforced Porous Reaction Bonded SiC (RBSC) composites and it fabrication process were developed by using Si melt infiltration process. The porosity and average pore size in fabricated chopped SiC fiber reinforced porous RBSC composites were in the range of $30{\sim}40%$ and $40-90{\mu}m$, which mainly determined by the SiC powder size used as starting material and amount of residual Si in porous composites. The maximum flexural strength of chopped SiC fiber reinforced porous RBSC composite was as high as 80 MPa. The delayed fracture behavior was observed in chopped SiC fiber reinforced porous RBSC composites upon 3-point bending strength test.
적응제어기법을 이용한 다자유도 진동모델의 위치 및 자세결정에 관한 연구
한재호,김재열,오환교 한국자동차공학회 1993 한국자동차공학회 춘 추계 학술대회 논문집 Vol.- No.-
To present the dynamic interference and response variation subjected to mass load for the object of six-degrees of freedom of vibration model, the result obtained are as follows:<br/> <br/> I) In the case of the object subjected to mass load, the experimentation is carried out on two-degrees of freedom of translation (one direction) and revolution(one direction).<br/> It is confirmed that kinetic equation is reasonable by ascertaining that interference of 0.19 arcsec occurs for the input of translation, 0.1 lμm and interference of 0.022μm does for the input of revolution, 0.5 arcsec.<br/> <br/> 2) In the case of making the operation of transfer matrix analog circuit, simulation is carried out by differentiating incomplete signal seleted by optional choice. ; so it is ascertained that the theory responses are almost accord wi th the experiment response by finding interference of 1. 7xl0 ̄³arcsec for the input of revolution, 0.1μm and interference of 1.4x10 ̄⁴ for the input of translation, 0.5 aresec on open-loop system.<br/>
한재호,신동갑,김대은 한국트라이볼로지학회 2019 한국윤활학회지(윤활학회지) Vol.35 No.5
In spite of progress in tribological research, machine component failure due to friction and wear has been reported frequently. This failure may lead to secondary damage that can cause huge expense for maintenance and repair. To prevent economic loss, it is important to detect and predict the initial failure point. In this sense, various researchers have been tried to develop Condition Monitoring (CM) method using Acoustic Emission (AE) generated while the materials undergo failure. In this study, effect of particles on friction and wear was investigated using the pin-on-plate friction test and AE signal was recorded with a band-width type AE sensor. The experiments were performed in dry and lubricant conditions using steel and glass as specimens. After the experiment, 3D laser microscope image was captured to evaluate the wear behavior quantitatively. The AE signal was analyzed in time-domain and frequency-domain. The amplitude was compared with the frictional results. The results of this study showed that particle generation accelerate wear, generate high magnitude AE signal and change the frequency characteristics of the signal. Also, lubricant condition test results showed low coefficient of friction, low wear rate, and low magnitude of AE signal compared to the dry condition. It is expected that the results of this study will aid in better assessment of wear in CM technology.
티오말산을 착화제로 하고 아미노에탄티올을 환원제로 하는 비시안계 무전해 Au 도금액의 석출 거동 및 도금 특성
한재호,김동현 한국표면공학회 2022 한국표면공학회지 Vol.55 No.2
Gold plating is used as a coating of connecter in printed circuit boards, ceramic integrated circuit packages, semiconductor devices and so on, because the film has excellent electric conductivity, solderability and chemical properties such as durability to acid and other chemicals. As increasing the demand for miniaturization of printed circuit boards and downsizing of electronic devices, several types of electroless gold plating solutions have been developed. Most of these conventional gold plating solutions contain cyanide compounds as a complexing agent. The gold film obtained from such baths usually satisfies the requirements for electronic parts mentioned above. However, cyanide bath is highly toxic and it always has some possibility to cause serious problems in working environment or other administrative aspects. The object of this investigation was to develop a cyanide-free electroless gold plating process that assures the high stability of the solution and gives the excellent solderability of the deposited film. The investigation reported herein is intended to establish plating bath composition and plating conditions for electroless gold plating, with thiomalic acid as a complexing agent. At the same time, we have investigated the solution stability against nickel ion and pull strength of solder ball. Furthermore, by examining the characteristics of the plated Au plating film, the problems of the newly developed electroless Au plating solution were improved and the applicability to various industrial fields was examined. New type electroless gold-plating bath which containing thiomalic acid as a complexing agent showing so good solution stability and film properties as cyanide bath. And this bath shows the excellent stability even if the dissolved nickel ion was added from under coated nickel film, which can be used at the neutral pH range.
캐피라리 전기 영동법에 의한 비시안 무전해 Au 도금액의 분석
한재호,김동현 한국표면공학회 2022 한국표면공학회지 Vol.55 No.2
In the non-cyanide-based electroless Au plating solution using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent, analysis of each component constituting the plating solution is essential for the analysis of the reaction mechanism. And component analysis in the plating solution is important for monitoring component changes in the plating process and optimizing the management method.