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Air-Bag 가압식 300 mm 웨이퍼 폴리싱 테이블의 가압 분포 해석
노승국,박종권,이상열,편도선 한국공작기계학회 2008 한국공작기계학회 춘계학술대회논문집 Vol.2008 No.-
In this paper, the contact pressure of the wafer and polishing pad were investigated through numerical analysis using FEM tool, ANSYS 9.0. The distribution of the contact pressure is one of main parameters affect on the flatness and surface roughness of polished wafers. Two types of air polishing head, a hard type head with ceramic disk and soft type head with air bag compression were considered. The effects of the table deformation and initial shape on the contact pressure and deformation were also examined. Both heads and tables were modeled as solid model and finite element model, and the material properties of polishing pads and rubber plate for the air-bag head were used based on the tensile tests. The distribution errors of the air-bag head were smaller than hard type head even when the table was convex or concave shape, so it could be concluded that the air-bag head is advantageous for the uniformity of the contact pressure.
Air-Bag 가압식 300 ㎜ 웨이퍼 폴리싱 테이블의 가압 분포 해석
노승국(S. K. Ro),박종권(J. K. Park),이상열(S. Y. Lee),편도선(D. S. Pyun) 한국생산제조학회 2008 한국공작기계학회 춘계학술대회논문집 Vol.2008 No.-
In this paper, the contact pressure of the wafer and polishing pad were investigated through numerical analysis using FEM tool, ANSYS 9.0. The distribution of the contact pressure is one of main parameters affect on the flatness and surface roughness of polished wafers. Two types of air polishing head, a hard type head with ceramic disk and soft type head with air bag compression were considered. The effects of the table deformation and initial shape on the contact pressure and deformation were also examined. Both heads and tables were modeled as solid model and finite element model, and the material properties of polishing pads and rubber plate for the air-bag head were used based on the tensile tests. The distribution errors of the air-bag head were smaller than hard type head even when the table was convex or concave shape, so it could be concluded that the air-bag head is advantageous for the uniformity of the contact pressure.
Air-Bag 가압식 300 ㎜ 웨이퍼 폴리싱 테이블의 가압 분포 해석
노승국(S. K. Ro),박종권(J. K. Park),이상열(S. Y. Lee),편도선(D. S. Pyun) 한국생산제조학회 2008 한국생산제조시스템학회 학술발표대회 논문집 Vol.2008 No.5
In this paper, the contact pressure of the wafer and polishing pad were investigated through numerical analysis using FEM tool, ANSYS 9.0. The distribution of the contact pressure is one of main parameters affect on the flatness and surface roughness of polished wafers. Two types of air polishing head, a hard type head with ceramic disk and soft type head with air bag compression were considered. The effects of the table deformation and initial shape on the contact pressure and deformation were also examined. Both heads and tables were modeled as solid model and finite element model, and the material properties of polishing pads and rubber plate for the air-bag head were used based on the tensile tests. The distribution errors of the air-bag head were smaller than hard type head even when the table was convex or concave shape, so it could be concluded that the air-bag head is advantageous for the uniformity of the contact pressure.