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최재원,류시정,박정환,류상완,김정구,송운,정연욱,Rehmana, M.,Choi, J.W.,Ryu, S.J.,Park, J.H.,Ryu, S.W.,Khim, Z.G.,Song, W.,Chong, Y. 한국초전도학회 2009 Progress in superconductivity Vol.10 No.2
We report our development of the fabrication process of sub-micron scale $Al-AlO_x-Al$ tunnel junction by using electron-beam lithography and double-angle shadow evaporation technique. We used double-layer resist to construct a suspended bridge structure, and double-angle electron-beam evaporation to form a sub-micron scale overlapped junction. We adopted an e-beam insensitive resist as a bottom sacrificing layer. Tunnel barrier was formed by oxidation of the bottom aluminum layer between the bottom and top electrode deposition, which was done in a separate load-lock chamber. The junction resistance is designed and controlled to be 50 $\Omega$ to match the impedance of the transmission line. The junctions will be used in the broadband shot noise thermometry experiment, which will serve as a link between the electrical unit and the thermodynamic unit.