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차훈용(Hun-Yong Cha),박용식(Yong-Sik Park),김재중(Jae-Jung Kim),손영갑(Young-Gap Son),장석원(Seog-Weon Chang),곽계달(Kae-Dal Kwack) 대한기계학회 2007 대한기계학회 춘추학술대회 Vol.2007 No.10
This study presents predicting mechanical life of relay which is mounting in PCB by the reliability tool ALT. The dominant failure mode of the relay is short of coil that was caused by heat mechanism. In Accelerated Life Test(ALT), we focused on observing the change of coil of relay according to different test condition of acceleration stresses(current and temperature). As a result, it has proved that life time decreased by increasing incoming current and temperature. Additionally, We have estimated the relation of life-stress and acceleration factor with ALT data.