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전자부품 냉각을 위한 Vapor chamber heat sink의 열성능 연구
김윤호(Yoon-Ho Kim),전현수(Hyeon-Soo Jeon),배수호(Soo-Ho Bae),차호진(Hojin Cha),구홍모(Hong-Mo Koo) 대한기계학회 2013 대한기계학회 춘추학술대회 Vol.2013 No.12
As the electronic devices is more accelerated the compact size, the light-weight and the high integrated trend of electronic components, the most increasingly the heat generation problem rises. Recently, there are growing interests in developing alternative heat sink devices. Vapor chamber heat sinks are heat-spreading systems that develop phase change to spread heat and are of increasing interest in the electronics industry. Vapor chambers are increasingly being investigated as a way to spread the heat generated by an electronic component to the base of a heat sink for typical heat sink applications. In this study, vapor chamber heat sinks have been performed to investigate the thermal performances under the natural convection and forced convection conditions and to compare their performance against copper base heat sink. It is fabricated to be used a real telecommunication equipment specifications. The thermal characteristics of vapor chamber heat sinks are studied according to various input power using dummy heater, test jig and fan. The study shows that vapor chamber heat sinks can thermally perform better than a copper block heat sink. The thermal conductivity of the vapor chamber is also numerically analyzed using CFD simulation and is compared to the experiment results. Thus vapor chamber heat sinks provide good performance alternative to typical heat sinks.