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박형 태양전지모듈 제작을 위한 저온 CP 공정 최적화에 관한 연구
진가언(Jin Ga-Eon),송형준(Song Hyung-Jun),고석환(Go Seok-Whan),주영철(Ju Young-Chul),송희은(Song Hee-eun),장효식(Chang Hyo-Sik),강기환(Kang Gi-Hwan) 한국태양에너지학회 2017 한국태양에너지학회 논문집 Vol.37 No.2
Thin crystalline silicon (C-Si) solar cell is expected to be a low price energy source by decreasing the consumption of Si. However, thin c-Si solar cell entails the bowing and crack issues in high temperature manufacturing process. Thus, the conventional tabbing process, based on high temperature soldering (> 250°C), has difficulties for applying to thin c-Si solar cell modules. In this paper, a conductive paste (CP) based interconnection process has been proposed to fabricate thin c-Si solar cell modules with high production yield, instead of existing soldering materials. To optimize the process condition for CP based interconnection, we compared the performance and stability of modules fabricated under various lamination temperature (120, 150, and 175°C). The power from CP based module is similar to that with conventional tabbing process, as modules are fabricated. However, the output of CP based module laminated at 120°C decreases significantly (14.1% for Damp heat and 6.1% for thermal cycle) in harsh condition, while the output drops only in 3% in the samples process at 150°C, 175°C. The peel test indicates that the unstable performance of sample laminated at 120°C is attributed to weak adhesion strength (1.7 N) between cell and ribbon compared to other cases (2.7 N). As a result, optimized lamination temperature for CP based module process is 150°C, considering stability and energy consumption during the fabrication.