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탄소섬유 복합재의 전극 감응형 네트워크를 통한 효율적인 손상 감지를 위한 광소결된 구리 나노잉크의 전도성 향상에 관한 연구
주성준(Sung-Jun Joo),유명현(Myeong-Hyeon Yu),김학성(Hak-Sung Kim) 한국비파괴검사학회 2017 한국비파괴검사학회지 Vol.37 No.6
본 연구에서는 탄소섬유 복합재의 손상 감지를 위한 구리 나노 잉크의 제조 및 광소결을 수행하였다. 구리 나노 잉크의 조성물에 따른 소결 특성을 탐색하기 위해 고분자 바인더의 양을 변화시켜가며 잉크를 제조하였다. 제조된 구리 나노 잉크는 탄소섬유 복합재 상에 인쇄되었고, 인쇄된 구리 나노 잉크는 최적 광소결조건 탐색을 위해 다양한 조건으로 소결되었다. 또한, 광소결 시 구리 전극의 박리를 방지하기 위하여 실레인을 추가적으로 첨가하여 나노 잉크를 제조 및 광소결을 수행하였다. 그 결과, 탄소섬유 복합재 상에 박리 없이 10.1 μΩ·cm의 비저항을 갖는 높은 전기 전도도를 갖는 구리 전극을 성공적으로 제작하였다. 더욱이, 이는 구리 테이프를 이용했을 때보다 훨씬 낮은 탄소섬유 복합재와의 접촉 저항(1.3 Ω)을 가지는 것을 확인하였다. In this study, copper (Cu) nano-ink was fabricated and flash light sintered to detect the damage of carbon fiber-reinforced composite. In order to investigate the sintering characteristics, various Cu nano-inks were prepared according to the wt% of polymeric binder. The fabricated Cu nano-inks were printed on carbon fiber-reinforced composite, and flash light sintered under various conditions. Also, silane was added to Cu nano-ink to prevent delamination of Cu nano-ink during flash light sintering. As a result, an optimally fabricated Cu electrode was achieved with high electrical conductivity (10.1 μΩ·cm) without damaging the carbon fiber-reinforced composite. Moreover, it was confirmed that the optimally fabricated Cu electrode had much lower contact resistance (1.3 Ω) with the carbon fiber-reinforced composite than the Cu tape.
구리 나노잉크의 유변학적 제어에 따른 인쇄성 및 소결특성에 관한 연구
주성준(Sung-Jun Joo),유명현(Myung-Hyeon Yu),김학성(Hak-Sung Kim) 대한기계학회 2015 대한기계학회 춘추학술대회 Vol.2015 No.11
Currently, there are many ongoing research efforts to utilize printed electronics in commercialization field. Since the quality of electronic devices made by printed electronics technique is highly influenced by the printing quality, printability is one of the most important factor. Therefore, in this work, several Cu nano-inks were fabricated in respect to wt% of poly(N-vinylpyrrolidone) (PVP) to investigate the printability. Also, the printed Cu nano-film was sintered using a flash light sintering method with controlling various sintering conditions to analyze correlation between printability and sinterability. The un-sintered and sintered Cu nano-films were characterized using various techniques such as 4-point probe method, 2-D profiler, and scanning electron spectroscopy (SEM). From these results, it was noticeable that the high uniformness of printing and low resistivity of 20.1 μΩ·cm were successfully accomplished about Cu nano-ink of 3 wt% PVP and 4 J/㎠ of flash light sintered (1 pulse, 5 ㎳ pulse duration) case.
광소결 방법을 이용하여 소결된 탄소나노튜브/구리 나노입자 잉크 패턴의 피로특성 향상에 관한 연구
주성준(Sung-Jun Joo),황현준(Hyun-Jun Hwang),김학성(Hak-Sung Kim) 대한기계학회 2014 대한기계학회 춘추학술대회 Vol.2014 No.11
For the flexible electronics, the sintered metallic nanoparticles (NPs) film is necessary to be durable in severe conditions such as bending, twisting, and stretching. In this work, the effect of carbon nanotube (CNT) in Cu NPs ink was investigated for increasing the fatigue property of CNT/Cu NPs ink patterns under repeatable bending condition. The CNT/Cu NPs ink was fabricated, and then the fabricated ink was printed on the flexible polyimide (PI) substrates by using a doctor blading method. For the sintering method, a flash light sintering process was used to sinter the CNT/Cu NPs ink patterns in few milliseconds with room temperature and ambient condition. The fatigue characteristics of the flash light sintered CNT/Cu NPs ink patterns were estimated using the outer bending fatigue tests with three different bending radius (7 mm, 10 mm, and 15 mm). It was a noteworthy that the flash light sintered CNT/Cu NPs ink pattern showed higher mechanical durability after 103 cycles than Cu NP ink pattern by adding only 1 wt% of CNT (The resistance change (ΔR/R0) of the Cu NW/NP film was 6.02 while that of the Cu NP film was 84.03 at 103 cycles under the 7 mm of the bending fatigue radius). Furthermore, the sheet resistance of flash light sintered CNT/Cu NPs ink pattern decreased than that of Cu NPs ink pattern (The sheet resistance of the Cu NPs ink pattern: 128.01 μΩ·cm, CNT/Cu NPs ink pattern: 110.49 μΩ·cm). Therefore, it is expected that CNT/Cu NPs ink will be used in the future in flexible electronics applications.