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몰드물성 및 Chip의 크기차이에 따른 웨이퍼 레벨 SiP에 대한 열 피로 해석 모사
김성걸(Kim Seong Keol),김주영(Kim Joo-Young),정호동(Jung Hoo-Dong),김재호(Kim Jae Ho) 한국생산제조학회 2009 한국생산제조시스템학회 학술발표대회 논문집 Vol.2009 No.5
This paper describes in detail the life prediction models, and simulation of thermal fatigue under different mold compounds and chip sizes for wafer level embedded SiP. A 3D Finite element model was built to simulate the viscoplastic behaviors for mold compounds and chip sizes. Especially, bonding parts between mold and Silicon Nitride(Si₃N₄) were carefully modelled and distribution of strains was studied. Three different chip sizes were used and the effects of mold compounds were observed. Consequently, this numerical study shows that type-A has better fatigue life than other mold compounds. Also, 4×4 size chip has a shorter life than 6×6 and 8×8 size.
몰드물성 및 Chip의 크기차이에 따른 웨이퍼 레벨 SiP에 대한 열 피로 해석 모사
김성걸,김주영,정호동,김재호 한국공작기계학회 2009 한국공작기계학회 춘계학술대회논문집 Vol.2009 No.-
This paper describes in detail the life prediction models, and simulation of thermal fatigue under different mold compounds and chip sizes for wafer level embedded SiP. A 3D Finite element model was built to simulate the viscoplastic behaviors for mold compounds and chip sizes. Especially, bonding parts between mold and Silicon Nitride(Si₃N₄) were carefully modelled and distribution of strains was studied. Three different chip sizes were used and the effects of mold compounds were observed. Consequently, this numerical study shows that type-A has better fatigue life than other mold compounds. Also, 4×4 size chip has a shorter life than 6×6 and 8×8 size.