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Thermal VIA 설계에 따른 PCB 방열 특성 분석
최성열(SeongyeolChoi),성시환(SihwanSung),정현철(DongkyuKim),김동규(DongkyuKim) 한국자동차공학회 2020 한국자동차공학회 학술대회 및 전시회 Vol.2020 No.11
As the development of autonomous vehicle progressed rapidly, more electronic control units are required by in restricted space of car, accordingly this reason why related unit has more complexity than previous structures. For smaller ECUs, various portion need to be reviewed. One of the items to be reviewed is thermal characteristic. This paper intend to direction of thermal design of PCB, based on simulation results of thermal VIA design of components.