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SAC305 솔더, Sn58%Bi 솔더 및 에폭시 Sn58%Bi 솔더와 OSP표면처리된 PCB기판 접합부의 미세조직 및 낙하충격시험 평가
김경열(Kyung-Yeol Kim),정학산(Haksan Jeong),명우람(Woo-Ram Myung),정승부(Seung-Boo Jung) 대한용접·접합학회 2018 대한용접·접합학회지 Vol.36 No.2
Lead free Sn3.0%Ag0.5%Cu (SAC305) solder and low temperature Sn58%Bi solder have been widely used to replace lead based solder alloys. Because Sn58%Bi solder has poor ductility and shock absorbance ability, previous researches have tried to improve its mechanical properties by adding additional elements, reinforcements, carbon nano tube (CNT) and polymer. The bonding strength and drop impact reliability of SAC305 solder, Sn58%Bi and epoxy contained Sn58%Bi solder (epoxy Sn58%Bi solder) assembled on the OSP surface finished PCB substrate were investigated using low speed shear and board drop impact tests. After soldering, Cu6Sn5 intermetallic compound (IMC) was formed in the solders and OSP surface finished PCB substrate joints. Bonding strength and drop reliability of epoxy Sn58%Bi solder had superior mechanical properties than those of SAC305 solder and Sn58%Bi solder. The crack in the solder joint of SAC305 after board drop impact testing takes place within the IMC layer. However, the crack at the solder joint of the Sn58%Bi after board drop impact testing occurred on the interface between IMC layer and Sn58%Bi solder and the crack in the solder joint of the epoxy Sn58%Bi presented within the solder, respectively.
열충격시험과 3점굽힘시험을 통한 BGA 패키지 신뢰성에 미치는 언더필과 코너필의 영향
김경열(Kyung-Yeol Kim),정학산(Haksan Jeong),김상우(Sang-Woo Kim),방제오(Jae-Oh Bang),정승부(Seung-Boo Jung) 대한용접·접합학회 2020 대한용접·접합학회지 Vol.38 No.2
The reliability of a BGA component packaged with underfill and cornerfill was evaluated by 3-point bend test under two thermal shock conditions. The BGA component packaged with cornerfill failed before 500 cycles at a temperature range of -40 ~ 125 ℃. Crack propagation occurred between the Sn3.0-Ag0.5Cu solder and (Cu, Ni)₆Sn₅ intermetallic compound of the BGA component side. Both the BGA components packaged with soldering and underfill passed the thermal shock test under two conditions. However, the SAC305 BGA component assembled with cornerfill only passed a thermal shock in the range of –40 ~ 85 ℃. After 2,000 thermal shock cycles under two temperature conditions, bending reliability was evaluated by 3-point bend test. The SAC305 BGA component packaged with underfill showed superior bending reliability of over 3,000 bend cycles. The early failure (before 500 thermal cycles) of the SAC305 BGA component assembled by cornerfill was considered to be related to the coefficient of thermal expansion (CTE) and glass transition temperature (Tg) of the cornerfill material.