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마이크로파 흡수 메타구조체 충진성형에 관한 실험적 연구
한준세(J.S.Han),박현진(H.J.Park),정지영(J.-Y.Jeong),정준교(J.Jung),곽은지(E.-J.Gwak),전은채(E.-c.Jeon),신종화(J.H.Shin),제태진(T.-J.Je),최두선(D.-S.Choi) 대한기계학회 2021 대한기계학회 춘추학술대회 Vol.2021 No.11
Conductive ink filling process was experimentally developed and optimized for fabrication of ultra-andwidth microwave absorbing meta-structure. Developed overall fabrication process consists of mechanical machining, polymer replication, and ink filling process. Effects of ink-fill parameters including blade type, ink viscosity, pattern depth, and blade speed were experimentally characterized to achieve uniformly filled flexible double square loop array. Under optimizing processing conditions, large-scale flexible film type meta-structure fabrication process was established.