http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
정승부 成均館大學校 科學技術硏究所 1996 論文集 Vol.47 No.2
Reaction diffusion and formation of Ni_3AL phase with L1_2 structure has been studied at temperature from 1423 to 1573K using the diffusion couple of (Ni-40.5at%Al)/(Ni-15at%Al) and (Ni-49.2at%Al)/(Nickel). The layer growth of Ni_3-Al phase in the annealed diffusion couple was measured by optical microscope and electron probe microanalyzer(EPMA). The layer growth of Ni_3Al phase in this experimental temperature range was controlled by the volume diffusion mechanism. The rate of layer growth of Ni_3-Al phase was found to be closely related to the composition of NiAl phase. The activation energy for layer growth of Ni_3Al phase was calculated to be 127kJ/mol.
WC-Co/Cu/SM45C강접합에 미세조직 및 접합강도에 미치는 냉각속도의 영향
정승부,양훈모 대한용접접합학회 1999 대한용접·접합학회지 Vol.17 No.2
The interfacial microstructure and bond strength were examined for WC-Co/Cu/SM45C steel join using a nickel-plated copper in vacuum at 1323K for 0.6ks∼3.6ks. After bonding, microstructure in bonding interface was observed by OM(Optical Microscopy), SEM(Scanning Electron Microscopy) and EPMA(Eelectron Probe Micro Analyzer). The oil cooling was carried out at 353K, the cooling rate in air and furnace was 22K/s and 4.4K/s. respectively. It was found that dendritic widths increased with the content of cobalt and bonding times at 1323K. As a whole, bond strength values at the same bonding condition decreased in this order: WC-13wt.%Co/SM45Csteel. WC-8wt.%Co/SM45Csteel and WC-4wt.%Co/SM45Csteel. The bond strength of WC-13wt.%Co/S45C steel joint in oil cooling was 273MPa. This value was greatly higher than those of 125MPa in furnace cooling and 93MPa in air cooling at 1323K for 0.6ks. The bond strength values were found to be closely associated with the content of cobalt in WC-Co and cooling rate.
전자현미경 In-Situ 관찰방법을 이용한 황동의 절삭성평가
정승부,임옥동,안성욱,Jung, Seung-Boo,Lim, Ok-Dong,An, Seong-Uk 한국현미경학회 1994 Applied microscopy Vol.24 No.3
In order to elucidate the machinability of lead brass, orthogonal machining experiment was conducted in SEM(Scanning Electron Microscope) equipped with a micro-machining device at a cutting speed of $7{\mu}m/s$ for brass containing 0.2 to 3wt% Pb. The microfactors (i.e., shear angle, contact length between chip and tool) were determined by in-situ observations. Machinability of brass containing lead is discussed in terms of the microfactors and the cutting resistant force tested by lathe cutting. The dynamic behavior of the chip formation of lead brass during the machining process was examined: The chips of lead brass form as a shear angle type. The shear angle increases with the content of lead in (6:4) brass. The pronounced effect of lead on the contact length between chip and tool was observed above 1% Pb. The cutting resistant force tested by lathe decreases remarkably with the lead content in brass. The observed microfactors are in close relation to the tested resistant force in macromachining.
Ni-NiAl 확산대에서 $Ni_3Al$ 상의 형성과 반응확산
정승부 대한용접접합학회 1997 대한용접·접합학회지 Vol.15 No.3
Reaction diffusion and formation of $Ni_3Al$phase with $L1_2$ structure have been studied in temperature range of 1432K to 1573K using the diffusion couple of (Ni-40, 5at%Al)/(Ni-14, 1at%Al) and (Ni-49, 2at%Al)/ (Nickel). The layer growth of Ni$_{3}$Al pyhase in the annealed diffusion couple was measured by optical microscope and electron probe microanalyzer (EPMA). The layer growth of $Ni_3Al$phase in diffusion zone obeyed the parabolic law without any indication of grain boundary effects. The layer growth of $Ni_3Al$phase in temperature range of 1423K to 1573K was mainly controlled by the volume diffusion mechanism. The rate of layer growth of $Ni_3Al$phase was found to be colsely related to the composition of intermetallic compound NiAl phase. The activation energy for layer growth of $Ni_3Al$phase was calculated to be 127kJ/mol.
다이아몬드 공구용 코발트계 합금 결합제의 제조 및 기계적 성질
이기선,정승부,Lee, Gi-Seon,Jeong, Seung-Bu 한국재료학회 2000 한국재료학회지 Vol.10 No.8
Diamond 공구용 Co-0.5C-(15∼20)Cr-20Ni-8W-(2∼7)Fe 합금 결합제를 볼밍링(ball-milling)법과 기계적 합금화(mechanical alloying) 법으로 합성하였다. stearic acid의 첨가 유무에 상관없이 Co-0.5C-(15∼20)Cr-20Ni-8W-(2∼7)Fe 합금의 경우 6시간 동안 합금화된 금속 분말에서 미세 접합(micro welding) 형상이 균일하게 관찰되었다. stearic acid를 첨가하지 않을 때는 부분적으로 조대화된 분말이 형성되었으나 2% 첨가한 경우 미세하고 판상의 분말이 얻어졌다. stearic acid가 첨가된 복합분말을 열간 압축하여 기계적 성질을 평가한 결과 굽힘강도 1100MPa, 경도 46H(sub)Rc의 특성을 나타냈다. Co-0.5C-(15~20)Cr-20Ni-8W-(2~7)Fe alloy bond in diamond-impregnated abrasive tool was synthesized by ball-milling and mechanical alloying process. When the powders were mechanical alloyed for 6h, micro-welding in most metal powders was observed irrespective of addition of stearic acid. Without stearic acid in metal powders, partial-ly coarse powders were obtained, which could be unfaverable to the densification of composite of composite powders. The hot-pressed compacts showed rupture strength of 1100MPa and hardness of about $46H_{RC}$, respectively.
Failure Mechanism of Pb-Bearing and Pb-Free Solder Joints under High-Speed Shear Loading
김종웅,정승부 대한금속·재료학회 2010 METALS AND MATERIALS International Vol.16 No.1
The failure behaviors of ball grid array (BGA) solder ball joints under the various loading speeds of the high-speed shear test were investigated both experimentally and with non-linear, 3-dimensional finite element modeling. Conventional Sn-37Pb and Pb-free, Sn-3.5Ag solder alloys were used to compare the failure behaviors. Far greater shear forces were measured by the high-speed shear test than by the low-speed shear test. The shear force further increased with increasing shear speed, mainly due to the high strain-rate sensitivity of the solder alloys. Brittle interfacial fractures were more easily achieved by the high-speed shear test in the Sn-3.5Ag solder joints, especially at higher shear speed. This result was discussed in terms of the relationship between the strain-rate of the solder alloy, the work-hardening effect, and the resulting stress concentration in the interfacial regions. However, no transition of the failure mode was observed in the high-speed shear test of the Sn-37Pb solder joints.
신영의,정승부 대한용접접합학회 1996 대한용접·접합학회지 Vol.14 No.3
This paper presents the investigations on the initial strength and its variation of Sn-Pb solder joint using different lead frames, such as are 42 alloy lead and Cu alloy lead. As the result of the lack of initial strength at solder joints, whose pitch is from 0.3 to 0.4mm, short circuit often occured at the solder joint by thermal shock or external impact. Therefore, in this paper investigations were performed on the initial strength and its variation of Sn-Pb solder joint as well as fractured mode with using different lead frames.