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이정환(Jung-Hwan Lee),윤홍우(Hong-Woo Yoon),유성열(Seong-Ryoul Ryoo),김종만(Jong-Man Kim),전지환(Ji-Hwan Jun),김철주(Chul-Ju Kim),서명원(Myung-Won Suh) 대한기계학회 2006 대한기계학회 춘추학술대회 Vol.2006 No.6
The purpose of this study is to investigate the cooling performance of heat sinks for telecommunication system by adequate natural convection. Heat generation rates of electronic components, temperature distributions of heat sinks and surrounding air are analyzed by experimental and numerical works. In order to perform the heat transfer analysis for the thermal design of telecommunication system, a program is developed. The program is capable of determining the arrangement of heat sources, interior fan capacity and configuration of the heat sink by graphic user interface environment. The simulation results indicate that a cooling capacity of up to 230W at a maximum temperature difference of 19℃ can be attainable. In order to verify the results from the numerical simulation, the experiment under the same condition is conducted, and their comparisons are made. Resulting, the design program can be a good tool to predict the effects of various parameters involved in the design of the heat sink for telecommunication system.