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무전해 니켈 도금액에서 착화제가 도금피막에 미치는 영향
전준미(Jun-Mi Jeon),구석본(Suck-Bon Koo),이홍기(Hong-Kee Lee),박해덕(Hae-Duck Park),심수섭(Su-Sap Shim) 한국표면공학회 2004 한국표면공학회지 Vol.37 No.6
Deposit charateristics of Electroless nickel(EN) were investigated with various complexing agents. As expected, the deposition rate of nickel is increased with pH and that of Phosphorous is decreased with pH. The result of SEM investigation shows that the rough surface crystallization is appeared with pH. It is show that the surface resistance of EN deposit is decreased with pH at 85℃.
무전해 구리 도금액에서 착화제가 접합력에 미치는 영향에 대한 고찰
이창면(Chang-myeon Lee),전준미(Jun-Mi Jeon),허진영(Jin-young Hur),이홍기(Hong-kee Lee) 한국표면공학회 2014 한국표면공학회지 Vol.47 No.4
The primary purpose of this research is to investigate how much the complexing agent in electroless Cu electrolytes will affect adhesion strength between copper film and Ta diffusion barrier for Cu interconnect of semiconductor. The adhesion strength using rochelle’s salt as complexing agent was higher than the case of using EDTA-4Na. Effect of complexing agent on adhesion strength and electrical resistivity was studied in crystal structural point of view.
구석본(Seok-Bon Koo),전준미(Jun-Mi Jeon),이창면(Chang-Myeon Lee),허진영(Jin-Young Hur),이홍기(Hong-Kee Lee) 한국표면공학회 2018 한국표면공학회지 Vol.51 No.4
The self-annealing which leads evolution of microstructure in copper electroplating layers at room temperature occurs after forming deposition layer. During the process, crystal orientation, size and sheet resistance of plating layer change. Lastly, it causes the change of physical and mechanical characteristics such as a tensile strength of plating layer. In this study, the variation of incorporated impurities, microstructure and sheet resistance of copper plating layer formed by electroplating are measured with and without inorganic additives during the self-annealing. In case of absence of inorganic additives, the copper layer presents strong total intensity of incorporated impurities. During the self-annealing, such width of reduction was significant. Moreover, microstructure and crystal size are increased while the tensile strength is decreased noticeably. On the other hand, in the presence of inorganic additives, there is no observable distinction in the copper plating layer. According to the observation on movements of the incorporated impurities in electrodeposition copper layer, within 12 hours the impurities are continuously shifted from inside of the plating layer to its surface after as-deposited electroplating. Within 24 hours, except for the small portion of surface layer, it is considered that most of the microstructure is transformed.
무전해 니켈 도금용액에 사용되는 안정제의 도금피막 특성에 미치는 영향
이홍기(Hong-Kee Lee),손성호(Seong-Ho Son),전준미(Jun-Mi Jeon),구석본(Suck-Bon Koo),허진영(Jin-Young Hur) 한국표면공학회 2004 한국표면공학회지 Vol.37 No.6
Bath stabilizers in the electroless nickel(EN) plating solution are known to prevent sudden bath decomposition and extend its lifetime. Further, every stabilizer has a different role and function in EN solution and it influences the surface structure. In this study, the effects of various stabilizers on the deposition rate, surface morphology, deposition content of phosphor and hardness were investigated.
이홍기(Hong-Kee Lee),손성호(Seong-Ho Son),이호영(Ho-Young Lee),전준미(Jun-Mi Jeon) 한국표면공학회 2007 한국표면공학회지 Vol.40 No.1
Ni coating layers were formed using a newly developed electroless Ni plating solution. The properties of Ni coating layer such as internal stress, hardness, surface roughness, crystallinity, solderability and surface morphology were investigated using various tools. Results revealed that internal stress decreased with plating time and reached 40 N/㎟ at 20 minutes of the plating time. Hardness increased with increasing P content and thickness. Surface roughness of the pad decreased with Ni and Ni/Au plating. Crystallinity decreased with increasing P content. Solderability based on wettability decreased with Ni and Ni/Au plating. Based on surface morphology, it is expected that Ni coating layer formed using a newly developed electroless Ni plating solution is lower than that formed using a commercial electroless Ni plating solution in possibility of black pad occurrence.
무전해도금법으로 형성한 Ni-P-SiC 복합도금막의 특성
이홍기(Hong-Kee Lee),이호영(Ho-Young Lee),전준미(Jun-Mi Jeon) 한국표면공학회 2007 한국표면공학회지 Vol.40 No.2
Ni-P-SiC composite coating layers were prepared by electroless plating method and their deposition rate, codeposition of SiC, morphology, surface roughness, hardness, wear and friction properties were investigated. The deposition rate was kept almost constant independent of the concentration of SiC in the plating solution, and the codeposition of SiC in the composite coating layer increased with increased concentration of SiC in the plating solution except the early stage. Vickers microhardness increased with respect to the increased codeposition of SiC and the heat treatment at 300℃ in air for 1 hour. It was found that the wear volume decreased with increased up to 50 wt.% of SiC codeposition, and that friction coefficient increased gradually with increased codeposition of SiC. Considering the wear and the friction behaviors, the composite coating layer obtained by using 50 wt.% of SiC codeposition is desirable for the practical application for anti-wear and anti-friction coatings.
SiC 나노입자를 이용하여 형성한 Ni-SiC 복합도금막의 미세구조 및 특성
이홍기(Hong-Kee Lee),손성호(Seong-Ho Son),이호영(Ho-Young Lee),전준미(Jun-Mi Jeon) 한국표면공학회 2007 한국표면공학회지 Vol.40 No.2
Ni-SiC composite coating layers were formed using two kinds of SiC nano-particles by DC electrodeposition in a nickel sulfamate bath containing SiC particles. The effect of stirring rate and SiC particle type on the microstructure and properties of Ni-SiC composite coating layers were investigated. Results revealed that the trend of deposition rate is closely related to the codeposition of SiC and the deposition rate of nickel, and the codeposition behavior of SiC can be explained by using hydrodynamic effect due to stirring. The average roughness and friction coefficient are closely related to the codeposition of SiC and SiC particle size. It was found that the Vickers microhardness of the composite coating layers increased with increasing codeposition of SiC. The composite coating layers containing smaller SiC particle showed higher hardness. This can be explained by using the strengthening mechanism resulting from dispersion hardening. Anti-wear property of the composite coating layers formed using 130 ㎚-sized SiC nano-particles has been improved by 2,300% compared with pure electroplated-nickel layer.
미세피치 플립칩 패키지 구현을 위한 EPIG 표면처리에서의 무전해 팔라듐 피막특성 및 확산에 관한 연구
허진영(Jin-Young Hur),이창면(Chang-Myeon Lee),구석본(Seok-Bon Koo),전준미(Jun-Mi Jeon),이홍기(Hong-Kee Lee) 한국표면공학회 2017 한국표면공학회지 Vol.50 No.3
EPIG (Electroless Pd/immersion Au) process was studied to replace ENIG (electroless Ni/immersion Au) and ENEPIG (electroless Ni/electroless Pd/immersion Au) processes for bump surface treatment used in high reliable flip chip packages. The palladium and gold layers formed by EPIG process were uniform with thickness of 125 nm and 34.5 nm, respectively. EPAG (Electroless Pd/autocatalytic Au) also produced even layers of palladium and gold with the thickness of 115 nm and 100 nm. TEM results exhibited that the gold layer in EPIG surface had crystalline structure while the palladium layer was amorphous one. After annealing at 250 nm, XPS analysis indicated that the palladium layer with thickness more than 22~33 nm could act as a diffusion barrier of copper interconnects. As a result of comparing the chip shear strength obtained from ENIG and EPIG surfaces, it was confirmed that the bonding strength was similar each other as 12.337 kg and 12.330 kg, respectively.
복합 착화제 첨가가 무전해 Ni-P 도금액의 특성에 미치는 영향
이홍기(Hong-Kee Lee),이호년(Ho-Nyun Lee),전준미(Jun-Mi Jeon),허진영(Jin-Young Hur) 한국표면공학회 2010 한국표면공학회지 Vol.43 No.2
In this study, the effects of multi-complex agents addition on characteristics of electroless Ni plating solution are investigated. The species and the concentration of complexing agents are major factors to control the deposition rate, P concentration, and surface morphology of plating films. Adipic acid increases the deposition rate in regardless of single- or mutli-complex agent addition. However, lactic acid effectively increases the deposition rate in case of multi-addition as the complex agents with adipic or sodium succinate acid. In addition, sodium citric acid and malic acid show good stabilizing effects of plating solution and lowering the deposition rate, because they have high complexibility. Therefore, it is suggested that the development of Ni-P plating solution suitable for diverse usages can be carried out systematically using the database from this study.