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구리 나노 잉크와 유연기판의 접착강도 향상에 관한 연구
전은범(Eun-Beom Jeon),주성준(Sung-Jun Joo),김학성(Hak-Sung Kim) 대한기계학회 2014 대한기계학회 춘추학술대회 Vol.2014 No.11
In this paper, to enhance the adhesion between the copper pattern and flexible substrate, the silane coupling agent was added in the copper nano-ink with respect to the weigh fraction of silane. After then, the PI(Polyimide) substrate was treated by oxygen plasma. To investigate the effect of the plasma treatment, the AFM(atomic force microscope) were performed. Also, the copper pattern sintered by flash light was observed using SEM(scanning electron microscope). The adhesion test using the pressure sensitive tape was performed to measure the adhesion strength between the copper pattern and the substrate. The bending fatigue characteristic of copper pattern was also suggested. The change of the electrical resistance was measured during the bending fatigue test. It was found that the copper pattern containing 3wt% silane coupling agent exhibited the highest adhesion strength (5B) and lowest resistivity 24.5 μΩ?cm).
플래시 메모리 칩의 잔류응력 제거를 위한 IPL 어닐링
전은범(Eun-Beom Jeon),김학성(Hak-Sung Kim) 대한기계학회 2012 대한기계학회 춘추학술대회 Vol.2012 No.11
Recently, ultra-thin chips with thicknesses of under 35 ㎛ have emerged as an option for thinner, high performance electronic devices. For reliable electronic devices and high throughput packaging processes, the mechanical properties of ultra-thin chips need to be accurately understood. Especially, the residual stress occurred due to shear force between the grinding wheel/ polish pad in wafer thinning process occurred in wafer thinning process could be affected the fracture strength of ultra-thin device. In this paper, the optimal condition to reduce the residual stress of the ultra-thin chip was found with respect to the various wafer thinning parameters. The residual stresses distributions along the thickness direction of the ultra-thin flash memory chip before/after IPL annealing were measured using Raman spectroscopy. To validate the IPL annealing, we perform the BOR test to measure the fracture strength of ultra-thin flash memory chip. From the study, the effect of the residual stress and the fracture strength of ultra-thin flash memory chip with respect to IPL annealing were discussed.
손상 감지 모니터링을 위한 탄소섬유 복합재료와 인쇄된 은 전극 사이의 접촉저항 평가
전은범(Eun-Beom Jeon),Kosuke Takahashi,김학성(Hak-Sung Kim) 한국비파괴검사학회 2014 한국비파괴검사학회지 Vol.34 No.5
위치 감응형 전극 네트워크(addressable conducting network, ACN)는 탄소섬유 복합재료와 전극 사이의 접촉저항을 통해 구조물의 손상 감지가 가능하다. 손상 감지를 위한 위치 감응형 전극 네트워크의 신뢰성을 향상시키기 위해서는 전극과 복합재료 사이의 접촉저항이 최소화되어야 한다. 본 연구에서는 은 나노 전극을 탄소섬유 복합재료 위에 인쇄전자기술을 이용하여 제작하였다. 은 전극이 형성된 복합재료는 은 나노잉크의 소결온도와 복합재료의 표면거칠기에 따라 제작되었으며, 이에 따른 접촉저항을 측정하였다. 또한, 전자주사현미경(scanning electron microscope, SEM)을 통해 전극과 복합재료 사이의 계면을 관찰하였다. 본 연구를 통해, 은 나노 잉크의 소결온도가 120℃, 복합재료의 표면거칠기가 0.230a일 때, 0.3664Ω의 최소 접촉저항을 나타냈다. An addressable conducting network (ACN) makes it possible to monitor the condition of a structure using the electrical resistance between electrodes on the surface of a carbon fiber reinforced plastics (CFRP) structure. To improve the damage detection reliability of the ACN, the contact resistances between the electrodes and CFRP laminates needs to be minimized. In this study, silver nanoparticle electrodes were fabricated via printed electronics techniques on a CFRP composite. The contact resistance between the silver electrodes and CFRP were measured with respect to various fabrication conditions such as the sintering temperature of the silver nano-ink and the surface roughness of the CFRP laminates. The interfaces between the silver electrode and carbon fibers were observed using a scanning electron microscope (SEM). Based on this study, it was found that the lowest contact resistance of 0.3664 Ω could be achieved when the sintering temperature of the silver nano-ink and surface roughness were 120°C and 0.230 a, respectively.