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Ge-MOSFETs을 위한 Ni-Co 합금을 이용한 Ni-germanide의 열안정성 개선
박기영,정순연,장잉이,한인식,이세광,종준,신홍식,김영철,김재준,이가원,왕진석,이희덕,Park, Kee-Young,Jung, Soon-Yen,Zhang, Ying-Ying,Han, In-Shik,Li, Shi-Guang,Zhong, Zhun,Shin, Hong-Sik,Kim, Yeong-Cheol,Kim, Jae-Jun,Lee, Ga-Won,Wang, Jin 한국전기전자재료학회 2008 전기전자재료학회논문지 Vol.21 No.8
In this paper, Ni-Co alloy was used to improve thermal stability of Ni Germanide. It was found that uniform germanide is obtained on epitaxial Ge-on-Si substrate by employing Ni-Co alloy. Moreover, neither agglomeration nor penetration is observed during post-germanidation annealing process. The thermal stability of Ni germanide using Ni-Co alloy is improved due to the less agglomeration of Germanide. Therefore, the proposed Ni-Co alloy is promising for highly thermal immune Ni germanide for nano scale Ge-MOSFETs technology.