http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
송준엽(J.Y. Song),강재훈(J.H. Kang),이창우(C.W. Lee),하태호(T.H. Ha),지원호(W.H. Jee),김원경(W.K. Kim) 한국정밀공학회 2005 한국정밀공학회 학술발표대회 논문집 Vol.2005 No.10월
In this study, 6” GaAs wafer bonding system is designed and optimized to bond 6 inches device wafer and material wafer. Bonding process is performed in vacuum environment and resin is used to bond two wafers. Vacuum module and double heating mechanisms are adopted to minimize wafer warpage and void. Structure and heat transfer analysis, et al of the core modules review the designed mechanisms are very effective in performance improvement. As a result, high productivity (tack time cut-down) and stabilized process can be obtained by reducing breakage failure of wafer.
송준엽(J.Y. Song),이창우(C.W. Lee),하태호(T.W. Ha),정연욱(Y.W. Jung),김영규(Y.G. Kim),이명철(M.C. Lee) 한국정밀공학회 2006 한국정밀공학회 학술발표대회 논문집 Vol.2006 No.5월
In this study, automatic assembly and evaluation system for phone camera module is conceptually designed. The designed core(Auto focus & UV curing, Image Test) equipments adopts a clustering mechanism and compactible structure using index table for minimum tact time. Using a ball screw actuator and absolute encoder in each axis, we can verifies the repeatability and position accuracy of system within ±3㎛. In result of simulation test, the proposed system is expected up to 30% in productivity than manual operation.