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전자재료에 응용되는 공정조성 Solders 의 크리프 강도
이성민 대한금속재료학회(대한금속학회) 1994 대한금속·재료학회지 Vol.32 No.8
In view of the importance of Pb-Sn eutectic alloy in soldered interconnection, the creep phenomena in eutectic bulk solders with microstructures similar to the solder joints have been investigated. A variety of loading paths (tensile, fatigue, load relaxation, and creep) along with microstructural examination were employed to characterize constitutieve behavior and identify potential creep mechanisms(e.g. grain boundary sliding) that might have an impact on fatigue. The experimental work was directed as a clearer description of what some of these phenomena might actually be and how they might be related to the underlying creep mechanisms. The mechanisms of grain boundary sliding and creep strengthening in a wavy eutectic alloy were proposed and the creep strength can be explained based on the stabilized subgrain boundaries caused by the two-phase microstructure.
이성민,Lee, Seong-Min 한국군사과학기술학회 2006 한국군사과학기술학회지 Vol.9 No.4
In this paper a sequence estimator of CDMA communication system is suggested. A sequence estimator uses Galois Field operation. A sequence estimator can provide another CDMA pilot signal which is un-modulated spreaded signal. A estimated sequence signal and received signal have no correlation. Tow signals can be summed using MRC(maximal ratio combine) method. The stronger signal can be added as a larger ratio, but the weaker signal can be added as a smaller ratio. We can distinguish strong signal using SNR estimator. Therefore it is possible to receive an additional pilot signal, and to support more reliable communications by using sequence estimator.