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43Sn-57Bi 계 solder 에서 합금원소의 첨가가 젖음성 및 계면반응에 미치는 영향
이도재,이경구,이재진 대한금속재료학회(대한금속학회) 1996 대한금속·재료학회지 Vol.34 No.5
Solderability and interfacial reaction between 43Sn-57Bi-X solders and Cu-substrate were studied. The solderability of 43Sn-57Bi-X solders on Cu substrate was examined as a function of soldering temperature, soldering time and types of flux. Cu/solder joints were subjected to aging treatments for up to 60days to see interfacial reaction at 100℃ and then examined changes of microstructure and interfacial compound by optical microscopy and EDS. Addition of small amount of Cu, Ag and Zn, respectively, to solder result in decreased spread area on Cu substrate with RMA-flux treatment. but addtion of Ag and Zn showed increased spread area with R-flux treatment. According to the result of EDS, it was analyzed that the interfacial zone between solder and Cu-substrate was composed of Cu₃Sn and Cu_6Sn_5. But addition of Zn resulted in suppression of Cu_xSn_y, compound formation because of superior tendency to Cu_xZn_y compound formation.
Al/SiC 복합재료에서 보강재에 도금된 금속층이 젖음성에 미치는 영향
이도재,이경구,기회봉 대한금속재료학회(대한금속학회) 1998 대한금속·재료학회지 Vol.36 No.2
Effects of coating treatment of metallic Cu and Ni-P film on SiC fiber for Al/SiC composite were studied. Ni-P and Cu were deposited on SiC fiber by electroless plating method. The morphology of coated film and wetting behavior of composite were analysed by SEM The coating treatment on SiC fibers improved wettability of Al melt on SiC comparing to the non wated SiC fiber, and especially Ni-P coating turned out most effective. This improved wettability seems strongly concerned to the increase of chemical reactivity between coating layer and Al matrix. The reaction between Al melt and coated metallic film forms eutetic melt, and those reaction may accelerates the break down of Al oxide film to promote wettability positively.
Sn-Bi 계 Solder 에서 Sn 함량이 습윤성 및 계면반응에 미치는 영향
이도재,이경구,이재진 대한금속재료학회(대한금속학회) 1995 대한금속·재료학회지 Vol.33 No.8
Solderability and interfacial reaction between Cu-substrate and Sn-Bi solder were studied. Experimental variables included Sn contents, types of flux and soldering temperature. Some solder joints are subjected to aging treatments for up to 90 days to see interfacial reaction at 100℃. Analysing the experimental result concerning solderability, it was found that the role of Sn contents is increasing spread area on Cu substrate during soldering. A similar effect is observed by increasing soldering temperature and using activated flux(RMA flux) instead of using non-activated flux(R flux). According to the result of EDXS(Energy Dispersive X-ray Spectrometer), it is supposed that the soldered interfacial zone was composed of Cu₃Sn and Cu_6Sn_6. Those intermetallic compound formed in interfacial zone changed entirely to Cu₃Sn after 5days annealing at 100℃.
In , Bi 가 첨가된 Sn-9wt.%Zn/Cu 접합부의 납땜성 및 기계적 성질
이도재,이경구,백대화 한국주조공학회 2000 한국주조공학회지 Vol.20 No.2
Interfacial reaction and mechanical properties between Sn-Zn-X ternary alloys(X : 3wt.%In, 4wt.%Bi) and Cu-substrate were studied. Cu/solder joints were subjected to aging treatments for up to 50days to see interfacial reaction at 100℃ and then were examined changes of microstructure and interfacial compound by optical microscopy, SEM and EDS. Cu/solder joints were aged to 30days and then loaded to failure at cross head speed of 0.3㎜ min^(-1) to measure tensile strength. According to the results of the solderability test, additions of In and Bi in the Sn-9wt.%Zn solder improve the wetting characteristics of the alloy and lower the melting temperature. Through the EDS and XRD analysis of Cu/Sn-9wt.%Zn solder joint, it was concluded that the intermetallic compound was the γ-Cu_5Zn_8 phase. Cu-Zn intermetallics at Cu/solder interfaces played an important role in both the microstructure evolution and failure of solder joints. Cu/solder joint strength was decreased by aging treatment, and those phenomenon was closely related to the thickening of intermetallic layer at Cu/solder joints.
Al-SiC 복합재료에서 금속박막으로 피복처리된 SiC 와 Al 기지금속 사이의 계면현상에 관한 연구 (1) : 습윤현상
이도재,문길원 대한금속재료학회(대한금속학회) 1992 대한금속·재료학회지 Vol.30 No.4
The wetting phenomena between A1 matrix and metal coated SiC fiber have been studied at 670℃ for 15 min-60 min under vacuum. SiC fibers were coated about 1000Å thickness with Ag, Cu, and Ni metal in high vacuum evaporator. The wetting behavior of Al/metallic thin film/SiC fiber was analysed by SEM, AES, and XRD. The wettability of metal coated SiC fibers was better than as-recieved SiC fiber, especially Ag and Cu coated SiC fibers were more effective. It was considered Chat the driving force for wetting was increased by interfacial reaction between metallic thin film and Al melt. When interfacial reaction involved the eutectic reaction, the interfacial free energy was sufficiently reduced to improve the wetting behavior, and aluminum oxide film was easily broken down by eutectic melt. The wetting behavior of as-recieved SiC fiber was not uniform and the contact angle was larger than 90°.
Fe-Cu 계에서 Cu 가 Coating 된 Fe 분말 압분체의 치수팽창 현상에 관한 연구
이도재,문길원,양현삼,이경구 대한금속재료학회(대한금속학회) 1992 대한금속·재료학회지 Vol.30 No.10
The swelling and alloying behaviour of ferrous metal powder compacts have been studied using TMA(thermomechanical analysis) and optical microscope. Binary Fe-Cu compacts containing 3wt% Cu and up to 7wt% Cu were prepared from blends of Fe and Cu powders, and Cu coated Fe powders respectively. The TMA observations indicated that penetration of Cu-liquid phase into Fe particle and grain boundary leads to swelling of the powder compacts during heating and early stage of isothermal sintering at 1150˚C. Those swelling can be suppressed by using Cu coated Fe powder. The alloying process was accompanied by grain boundary penetration of Cu-rich liquid phase.
생체용 Ti합금의 산화거동에 미치는 Ta 및 Nb 첨가의 영향
이도재,오태욱,박범수,김수학,전충극,윤계림,Lee Doh-Jae,Oh Tae-Wook,Park Bum-Su,Kim Soo-Hak,Jun Choong-Geug,Yoon Kye-Lim 한국재료학회 2004 한국재료학회지 Vol.14 No.3
The oxidation behaviors of Ti-10Ta-10Nb alloy and Ti-6Al-4V alloy were studied in dry air atmosphere. Specimens were melted in consumable vacuum arc furnace and homogenized at $1050^{\circ}C$ for 24 h. Hot rolling was performed at $1000^{\circ}C$. Specimens of the alloys were oxidized as the temperature range $400~650^{\circ}C$ for 30 min. The oxidation behavior of the alloys was analysed by optical microscope, SEM/EDX, XRD, XPS and TGA. Immersion test was performed in 1% Lactic acid. In the microscope observation, oxide layer of Ti-10Ta-10Nb alloy was denser and thinner than Ti-6Al-4V's. The weight gains during the oxidation rapidly increased at the temperature above $600^{\circ}C$ in Ti-6Al-4V's alloy and$ 700^{\circ}C$ in Ti-10Ta-10Nb alloy. According to XRD results, oxide layers were composed of mostly $TiO_2$(rutile) phase. It was analysed that the passive film of the Ti alloys consisted of $TiO_2$ through X-ray photoelectron spectroscopy(XPS) analysis.
이도재,윤덕용 대한금속재료학회(대한금속학회) 1976 대한금속·재료학회지 Vol.14 No.3
Cu-10% Sn 오일레스 베어링 시편의 소결 과정에서 분말의 크기, 가열 속도 및 소결 시간이 칫수변화, 함유량, 압환강도 및 미세 조직 등에 미치는 영향을 조사하였다. 사용한 구리 분말의 크기는 -150mesh와 -270mesh였고, 주석 분말은 -230+325mesh와 -400mesh이었다. 시편은 수소와 질소의 혼합 gas 분위기에서 797℃와 807℃에서 15분까지 소결하였다. Cu-Sn 혼합 분말 압분체의 소결중 칫수 변화는 대부분 가열 도중에 일어났다. 분말이 클수록, 특히 주석 분말이 클수록, 팽창이 많이 일어났고, 가열 속도가 빠르면 또한 팽창도 많았다. 함유량과 압환강도는 대체로 밀도와 비슷한 변화를 보였다. 본 실험에서 나타난 입도 크기와 가열 속도의 칫수 팽창에 대한 영향은 고상 소결과 액상 소결로 인한 수축현상과 구리 분말 boundary에 액상의 penetration으로 인한 팽창 효과로 설명을 시도하였다. 미세한 혼합 분말로 만든 시편을 15분 소결하여 균일하고 입도가 큰 청동 합금 조직을 얻었다. 본 실험 결과의 실제 공정에 대한 의미도 논하였다. The effects of powder size, heating rate, and sintering time on dimensional change, oil impregnation, radial crushing strength, and microstructure were examined in sintered Cu-10% Sn mixture. The copper powder sizes were -150 mesh and -270 mesh, and tin powders were -230 +325 mesh and -400 mesh. The specimens were sintered in hydrogen-nitrogen atmosphere at 797℃ for sintering time up to 15 minutes. The dimensional change of Cu-Sn mixture compacts occurred mostly during the heating up stage. Larger powder size, in particular, larger tin powder size and faster heating rate caused more expansion. The oil impregnation and radial crushing strength changed in a way similar to the density change. The observed dependence of growth on particle size and heating rate can be explained by densification effects of the solid state and liquid state sintering and the growth due to the penetration of copper particle boundaries by tin rich melt. The specimen of fine powder mixture sintered for 15 minutes showed uniform bronze structure with large grains. The practical implications of the present results are discussed.