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Shield Disk 상의 Ag-Cu 공정계 합금 도금기술 개발
윤경도,차동관,심기종,민봉기,최순돈,이상기 嶺南大學校 工業技術硏究所 2003 工業技術硏究所論文集 Vol.31 No.1
The composition and the microstructure of the Ag-Cu alloy electrodeposits electroplated in Succinimide bath were investigated varying the electrolysis conditions such as bath composition, current density and additive agents etc. The cathode overpotential increased with the increase of Succinimide concentration and current density ratio in the bath. The Ag content of the alloy deposits decreased with the increase of current density and pH and temperature in the bath. The optimum condition for 78wt.%Ag-22wt.%Cu code position alloy is an follows : pH10(adjusted by NH_4OH), 0.03M AgNO_3, 0.27M Cu(NO_3)_2 3H_2O, 0.5M Succinimide in bath and 3.5A/dm^2∼5.5A/dm^2 current density.