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원종구(J.K.Won),이정택(J.T.Lee),이은상(E.S.Lee),이상렬(S.R.Lee),박종권(J.K.Park) 대한기계학회 2006 대한기계학회 춘추학술대회 Vol.2006 No.6
In recent years, developments in the semiconductor and electronic industries have brought a rapid increase in the use of large size silicon wafer. Polishing was implemented with a wafer which has an uniform surface roughness over the entire surface. In this study, the machining variables, which have major influence on the characteristics of Si wafer polishing, were adopted to polishing pressure, machining speed, and the slurry mix ratio. Slurry density, sorts of slurry, experimental temperature, pad and distance of oscillation were regarded as fixed factors. This paper will report a designed experimental study on surface polishing of 12 inch wafer and optimum condition of 12 inch wafer polishing which make flatness and surface quality improved was considered.
균일 가압을 적용한 Wafer Polishing 가공 성능에 관한 연구
원종구(J.K Won),이정택(J.T Lee),이은상(E.S Lee) 한국생산제조학회 2006 한국공작기계학회 춘계학술대회논문집 Vol.2006 No.-
Wafer polishing makes the surface planarization to achieve a high-quality. The pressure distribution is an important parameter of polishing process. This study shows the pressure distribution between the polishing pad and the wafer attached by machine's head. The experiments were performed to observe the morphology of pressure, when the machine's head was pressed down onto the polishing pad. It is found that the pressure distribution is depended on the damping materials in the preliminary experiment. To measure the pressure distribution, the pressure measuring film is used. The simulation result of head is compared with the measured pressure distribution. As the static pressures are compared, it will be shown the status of pressure by the damping materials of machine's head. On polishing experiment, vibration and frequency were measured and analyzed.
균일 가압을 적용한 Wafer Polishing 가공 성능에 관한 연구
원종구(J.K Won),이정택(J.T Lee),이은상(E.S Lee) 한국생산제조학회 2006 한국생산제조시스템학회 학술발표대회 논문집 Vol.2006 No.5
Wafer polishing makes the surface planarization to achieve a high-quality. The pressure distribution is an important parameter of polishing process. This study shows the pressure distribution between the polishing pad and the wafer attached by machine's head. The experiments were performed to observe the morphology of pressure, when the machine's head was pressed down onto the polishing pad. It is found that the pressure distribution is depended on the damping materials in the preliminary experiment. To measure the pressure distribution, the pressure measuring film is used. The simulation result of head is compared with the measured pressure distribution. As the static pressures are compared, it will be shown the status of pressure by the damping materials of machine's head. On polishing experiment, vibration and frequency were measured and analyzed.
12인치 웨이퍼 폴리싱 시스템의 성능 평가에 관한 연구
이정택(J.T. Lee),원종구(J.K. Won),이은상(E.S. Lee),이상렬(S.R. Lee),박종권(J.K. Park) 대한기계학회 2006 대한기계학회 춘추학술대회 Vol.2006 No.6
Wafer polishing makes the surface planarization to achieve a high-quality. The pressure distribution is an important parameter of polishing process. This study shows the pressure distribution between the polishing pad and the wafer attached by machine's head. The experiments were performed to observe the morphology of pressure, when the machine's head was pressed down onto the polishing pad. It is found that the pressure distribution is depended on the damping materials in the preliminary experiment. To measure the pressure distribution, the pressure measuring film is used. The simulation result of head is compared with the measured pressure distribution. As the static pressures are compared, it will be shown the status of pressure by the damping materials of machine's head. On polishing experiment, vibration and frequency were measured and analyzed.
균일 가압을 적용한 Wafer Polishing 가공 성능에 관한 연구
원종구,이정택,이은상 한국공작기계학회 2006 한국공작기계학회 추계학술대회논문집 Vol.2006 No.-
Wafer polishing makes the surface planarization to achieve a high-quality. The pressure distribution is an important parameter of polishing process. This study shows the pressure distribution between the polishing pad and the wafer attached by machine's head. The experiments were performed to observe the morphology of pressure, when the machine's head was pressed down onto the polishing pad. It is found that the pressure distribution is depended on the damping materials in the preliminary experiment. To measure the pressure distribution, the pressure measuring film is used. The simulation result of head is compared with the measured pressure distribution. As the static pressures are compared, it will be shown the status of pressure by the damping materials of machine's head. On polishing experiment, vibration and frequency were measured and analyzed.