http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
실험계획법에 의한 파라미터 분석과 Run to Run 제어를 이용한 폴리싱 공정 제어
안병운(B. W. Ahn),박성준(S. J. Park),이상조(S. J. Lee),윤종학(J. H. Yoon) 한국정밀공학회 2004 한국정밀공학회 학술발표대회 논문집 Vol.2004 No.10월
In this paper, polishing method using bonded magnetic abrasive particle has been applied to the micro mold polishing. Through process control using the Run-to-Run control, it tried to form the surface roughness In order to grasp the influence of the surface roughness which is reached by selection of control factor and the factor, a design of experiment was been processed. The study is processed with a purpose of to embody and to maintain the surface roughness of nano scale by the basis of an influence between a control factor and the factors which has been selected in this way. As a result, the result of the process control converged at a target value of surface roughness Ra 10㎚ and Rmax 50㎚.