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초가속수명시험(HALT) 및 고장분석을 이용한 실장기판의 신뢰성 향상방안
송병석,조재립,Song, Byeong-Suk,Cho, Jai-Rip 한국신뢰성학회 2004 신뢰성응용연구 Vol.4 No.2
HALT (Highly Accelerated Life Test) was performed to improve the reliability by removing the potential failure for newly developing PCB used for the vibration condition from 2OHz to 2OOHz. During HALT, it is found that the lead of Al electrolytic capacitor of SMD type is detached from PCB. As the result for the failure analysis and FEM (Finite Element Method), it is clarified that the root cause for this failure is the improper attachment of an Al electrolytic capacitor on PCB by the mistake of a PCB design. HALT was performed in previous condition to verify the failure analysis after molding an epoxy resin to overcome the PCB design mistake and it is not observed the same failure. Therefore, it is assumed that the same failure in field will be not occurred by the proper implementation.
광기기 저장매체 구동용 BLDC 모터의 신뢰성 평가기준
송병석(Byeong Suk Song),천성일(Sung il Chan),정해성(Hai Sung Jeong),백재욱(Jaiwook Baik) 한국신뢰성학회 2009 신뢰성응용연구 Vol.9 No.1
BLDC motors are stored in the devices such as CD-RW, COMBO, DVD-ROM and CD-ROM. It is indispensable to establish reliability assessment criteria for BLDC motors, especially in the world where IT grows rapidly. In this article, reliability certification procedure is given. The reliability certification procedure consists of two separate tests such as quality certification test and lifetime test. The former quality certification test comprises general performance test and environmental test. Items which pass the test undergo lifetime test which guarantees the extent of mean lifetime with certain confidence.
자동차 적용기기용 위성정보시스템 모듈의 신뢰성 평가기준
송병석(Byeong Suk Song),황순미(Soon Mi Hwang),천성일(Sung il Chan),정해성(Hai Sung Jeong),백재욱(Jaiwook Baik) 한국신뢰성학회 2009 신뢰성응용연구 Vol.9 No.2
GPS(Global positioning system) system is widely used in artificial satellite, ground controlled approach system as well as in end-user environment such as in the automobile. It is exposed to a very diverse environment and consists of many complicated components and therefore needs careful approach to the enhancement of reliability of the item. In this article reliability standards for the GPS system are established in terms of quality certification tests and failure rate tests.
Sn-3.0 Ag-0.5 Cu/OSP 무연솔더 접합계면의 접합강도 변화에 따른 전자부품 열충격 싸이클 최적화
홍원식,김휘성,송병석,김광배,Hong, Won-Sik,Kim, Whee-Sung,Song, Byeong-Suk,Kim, Kwang-Bae 한국재료학회 2007 한국재료학회지 Vol.17 No.3
When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.
홍원식,강보철,송병석,김광배,Hong Won Sik,Kang Bo-Chul,Song Byeong Suk,Kim Kwang-Bae 한국재료학회 2005 한국재료학회지 Vol.15 No.1
Recently a lots of problems have observed in high densified and high integrated electronic components. One of them is ion migration phenomena, which induce the electrical short of electrical circuit. ion migration phenomena has been observed in the field of exposing the specific environment and using for a long tin e. This study was evaluated the generation time of ion migration and was investigated properly test method through water drop test and high temperature high humidity test. Also we observed direct causes and confirmed generation mechanism of dendritic growth as we reproduced the ion migration phenomena. We utilized PCB(printed circuit board) having a comb pattern as follows 0.5, 1.0, 2.0 mm pattern distance. Cu, SnPb and Au were electroplated on the comb pattern. 6.5 V and 15 V were applied in the comb pattern and then we measured the electrical short time causing by ion migration. In these results, we examined a difference of ion migration time depending on pattern materials, applied voltage and pattern spacing of PCB conductor.
이근명,오웅,유성규,송병석,Lee, Keun-Myoung,Oh, Ung,Yoo, Sung-Kyu,Song, Byeong-Suk 한국전기전자학회 2015 전기전자학회논문지 Vol.19 No.1
스마트폰과 같은 모바일기기가 경박단소화 되고 작은 공간에 보다 많은 기능을 넣기 위한 경쟁이 치열해 지면서 내부에 사용되는 부품의 소형화가 급속히 진행되고 있다. 모바일 기기에서 메인보드와 배터리를 연결하는 배터리 커넥터의 경우도 마찬가지로 소형화되고 있으나 타 부품과 달리 커넥터 상에 흐르는 전류의 용량에 따른 발열 문제로 인해 소형화에 어려움이 있다. 본 논문은 모바일 커넥터 시장을 리드하고 있는 국내 기업과의 연구 협력을 통해 진행되었으며 국내 최초로 개발된 모바일 배터리용 초소형 커넥터에 대한 전기/열해석을 바탕으로 초소형 파워커넥터 커넥터 설계 시 고려하여야 하는 부분과 이러한 요소들에 대한 설계 방향을 제시한다. As the number of smartphone users grows, number of applications and the expected overall functionality in a smartphone grow simultaneously. With ever-so increasing expectations comes intense competition to squeeze in myriads of functions in a limited space that is only getting 'slimmer' by the year. In order to achieve this, companies often decrease the size of components in smartphones - battery connectors in particular. While they may fit, smaller battery connectors have their disadvantages due to the heat generated by the high current flow in the circuits. In collaborating with Korea's leading battery connector manufacturers, this research presents current issues and design concepts that should be considered when engineers design power connectors based on their electrical and thermal analysis.
홍원식(Won Sik Hong),송병석(Byeong Suk Song),정해성(Hai Sung Jeong),임재학(Hai Sung Jeong) 한국신뢰성학회 2009 신뢰성응용연구 Vol.9 No.2
An organic light emitting diode (OLED), also light emitting polymer (LEP) and organic electro luminescence (OEL), is any light emitting diode (LED) whose emissive electroluminescent layer is composed of a film of organic compounds. The layer usually contains a polymer substance that allows suitable organic compounds to be deposited. They are deposited in rows and columns onto a flat carrier by a simple "printing" process. The resulting matrix of pixels can emit light of different colors. Such systems can be used in television screens, computer displays, small, portable system screens such as cell phones and PDAs, advertising, information and indication. OLEDs can also be used in light sources for general space illumination, and large-area light-emitting elements. In this paper, we develop the general guide line of the accelerated life test for assuring B10 life of AMOLED(Active Matrix Organic Light Emitting Diode) and PMOLED(Passive Matrix Organic Light Emitting Diode) which are widely used for display monitor less than 115 ㎜.