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송길상 국립해양유산연구소 2024 해양문화재 Vol.0 No.20
중기重記란 국가재산의 누수를 막기 위하여 정기적으로 작성토록 규정한 회계장부 또는 물품조사서로 해유解由할 때 작성하는 전현직 관료간의 재물 인수인계서이다. 전라좌수영의 중기인 『호좌영중기』는 헌종 3년(1837) 4월 작성된 문서로 군선, 창고, 군기軍器, 기치旗幟, 유고분留庫分 현황 등의 사항이 기록되어 있다. 이 논문은 『호좌영중기』를 통해 18세기 중반 ~ 19세기 중반 전라좌수영의 군비체계 및 수조현황을 분석하고자 했다. 먼저 『호좌영중기』와 영지營誌인 『호좌수영지』를 통하여 전라좌수영 본영이 보유하고 있었던 전선, 병선 및 사후선의 규모와 전투요원인 포수, 사수, 화포장 및 능로군 등 승선인원을 분석했다. 또한 전라좌수영이 보유하고 있었던 지자총통을 비롯한 거치형 화약무기와 조총 등 소형화약 무기, 분화통噴火桶 등 근접전용 화약무기, 방어용 무기인 방패와 갑주현황 등을 분석했다. 또한 『호좌영중기』에는 1734년에서 1772년 까지 수조水操 때 화약과 연환 분급현황이 기록되어 있다. 이 기록을 통해 전라좌수영의 수조추이를 비교해 보았다. 이 기간 실시된 수조는 25회 였으며 춘조 3회, 추조 22회로 대부분 가을에 이루어졌다. 1회 수조시 평균 화약 분급량은 약 161근, 연환 분급량은 438개였다. 『호좌영중기』에 나타난 수조에 화약과 연환을 분급한 마지막 해는 1772년이며 이후에는 분급한 기록이 나타나지 않는다. 이는 1773년 이후 전라좌수영 수조시 화약과 연환을 사용하지 않았기 때문인 것 같다. 수조는 선상에서 선단의 대형(진陣)을 갖추고 조총과 활을 이용하여 사격을 연습하는 훈련이다. 그러나 『호좌영중기』에 나타난 전라좌수영의 수조 경향을 살펴보면 1780년대 이후 수조의 중지가 잦아지고, 수조가 실시된다 하여도 화약무기에 기반한 실제 훈련이 아닌 모의훈련으로 변해갔음을 확인해보고자 했다. The Jeolla Jwasuyeong was one of the divisions of the Joseon Navy. In Joseon, the Navy established its headquarters, known as the Tongjeyeong, and its naval divisions in special naval commands known as the Jeolla Jwasuyeong, Jeolla Usuyeong, Gyeongsang Jwasuyeong, and Chungcheong Suyeong. The term Jung-gi refers to an accounting ledger or inventory report that was prepared on a regular basis to prevent leakages or losses of state property, or to a document of a property handover between former officials due to a change in management. The Junggi document of the Jeolla Jwasuyeong, called Hojwayeong jung-gi, written in April 1837, records information on warships and weapons among other matters. This paper aims to analyze the naval training and armament systems of the Jeolla Jwasuyeong from the mid-eighteenth to the mid-nineteenth century based on an examination of the Hojwayeong jung-gi. It covers such matters as the size of the fleet, combat personnel, operational personnel, and weaponry including firearms, shields, and armor. Furthermore, the Hojwayeong jung-gi records the supply of gunpowder and bullets during maritime training exercises, known as sujo, from 1734 to 1772. This record was used as a source material in the analysis of the naval training situation at the Jeolla Jwasuyeong.During this period, twenty-five naval exercises were conducted, with the majority (twenty-two exercises) taking place in the fall and the rest in the spring (three exercises). Additionally, it is possible to determine the amount of gunpowder and the total number of bullets etc. used in one naval exercise. The last year gunpowder was used in guns and cannons during the "Hojwayeong jung-gi" was 1772 and there are no records of gunpowder use thereafter. It seems that after 1773, the Jeolla Jwasuyeong did not use gunpowder in the maritime training exercises, even though such exercises generally involved gunnery practice with guns and bows on board a ship. However, after examining the maritime training trends of the Jeolla Jwasuyeong as described in the Hojwayeong jung-gi, it becomes evident that the frequency of training suspensions increased after 1780, and that there was a tendency not to use gunpowder weapons even during maritime training exercises.
승온 경화반응속도식을 이용한 LED용 실리콘 렌즈의 유한요소해석
송민재(M. J. Song),홍석관(S. K. Hong),박정연(J. Y. Park),이정원(J. W. Lee),윤길상(G. S. Yoon) 한국소성가공학회 2014 금형가공 심포지엄 Vol.2014 No.8
Silicone is recently used for LED chip lense due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for curing process during silicone molding. For analysis of curing process, a dynamic cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the slow cure reduced abrupt reaction heat and it was predicted decrease of the residual stress.
LED encapsulation 실리콘의 기포잔류방지를 위한 step 경화공정 연구
송민재(M.J.Song),김흥규(H.K.Kim),윤길상(G.S.Yoon),김권희(K.H.Kim) 한국소성가공학회 2011 금형가공 심포지엄 Vol.2011 No.9
Generally, rapid cure reaction of LED encapsulation silicone resin causes serious defects in a cured resin product such as warpage, residual bubbles, and decreasing wetablility. In order to prevent residual bubbles in a silicone resin, step cure process was examined in the present paper. Three kinds of step cure processes were applied and bubble free phenomenon was observed experimentally. Experimental results showed that most of bubbles were removed under 70˚C which is the minimum temperature for activating cure reaction. In addition, degree of cure(DOC) and temperature distribution were predicted by using FEM analysis of heat transfer. It was concluded that maintaining cure temperature for providing DOC of less than 0.5~0.6 is an effective way to reduce residual bubbles and stress.
LED encapsulation 실리콘의 step 경화공정 연구
송민재(M. J. Song),김흥규(H. K. Kim),윤길상(G. S. Yoon),김권희(K. H. Kim) 한국소성가공학회 2011 한국소성가공학회 학술대회 논문집 Vol.2011 No.10
Generally, rapid cure reaction of LED encapsulation silicon resin causes serious defects in a cured resin product such as warpage, residual bubbles, and decreasing wetability. In order to prevent residual bubbles in a silicone resin, step cure process was examined in the present paper. Three kinds of step cure processes were removed under 70℃ which is the minimum temperature for activating cure reaction. In addition, degree of cure(DOC) and temperature distribution were predicted by using FEM analysis of heat transfer. It was concluded the maintaining cure temperature for providing DOC of less than 0.5~0.6 is an effective way to reduce residual bubbles and stress.