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소의열 한국공작기계학회 2001 한국생산제조학회지 Vol.10 No.5
A measuring system is developed to acquire static image from rotary state through CCD camera in back light illumination by synchronizing chopper to workpiece. In image processing of acquired image, lowpass filter is very useful in view of noise removal, and optimum binary image can be made through histogram equalization which is one of the histogram technique to maximize brightness intensity between workpiece and background. After image treatment applying Laplacian operator, surface roughness is calculated by introducing conversion coefficient of pixel which edge is composed of.
정을섭,김성청,김태봉,소의열,이근상 한국공작기계학회 2002 한국생산제조학회지 Vol.11 No.3
In this study, experiments were carried out to investigate the characteristics of grinding and wear process of diamond wheel for ceramic materials. Normal component of grinding resistance of AL_2O_3 was less than that of Si_3N_4 and ZrO_2. This seems to be the characteristics of ceramic tools on work pieces both of high hardness. For the case of Si_3N_4 and ZrO_2 as the mesh number of wheel increases, the surface roughness decreases. For the case of Al_2O_3, the surface roughness does not decreases. Specific grinding energy decreases as the material removal rate per unit time increases. For the case of Si_3N_4 and ZrO_2, grinding is carried out by grain shedding process due to brittle fracture.
세라믹 연삭에서 결합제에 따른 다이아몬드 휠의 마멸 특성
공재향,유봉환,소의열,이근상,유은이,임홍섭 한국공작기계학회 2002 한국생산제조학회지 Vol.11 No.4
In this study, experiments were carried out to investigate the characteristics of grinding and wear process of diamond wheel during grinding ceramic materials. Normal component of grinding resistance was decreasing while increased of spindle speed. The resistance of vitrified bond wheel was less than that of resinoid bond wheel because of imbedded large holes on the surface of cutting edge. Surface roughness was decreasing while of spindle speed. The surface roughness using vitrified bond wheel was less than that of resinoid bond wheel because of small elastic deformation. After continuous grinding of ceramics, cutting edge ratio of resinoid bond wheel decreased. For the case of vitrified bond wheel, cutting edge ration did not change.