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3차원 프린팅을 활용한 부분적 빈 공간 기판 집적 도파관과 1:2 진행파 전력합성기
한성희(Seong-Hee Han),성하욱(Ha-Wuk Sung),김동욱(Dong-Wook Kim) 대한전기학회 2021 전기학회논문지 Vol.70 No.8
In this paper, we propose a partially hollow microstrip line(PHMLIN), partially hollow substrate integrated waveguide(PHSIW) and their transition that are implemented using the 3D printing techniques of light induced planar solidification(LIPS) and metal line printing. A partially hollow structure uses a resin substrate whose most part is removed and filled with air. Although they are implemented on a relatively lossy substrate, the PHMLIN and PHSIW show better transmission performance, compared with other conventional microstrip line and substrate integrated waveguide(SIW). The PHMLIN-PHSIW transition has an insertion loss of about 0.2 dB at 7 GHz. Using the proposed 3D printed structures, a 1:2 traveling-wave power combiner is demonstrated, and shows an insertion loss of less than 0.87 dB and a power combining efficiency of 82.1~87.9% in 6.5~7.5 GHz. The proposed structures using 3D printing are very useful for small quantity batch production of microwave components.