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Ellipsometry를 이용한 193 nm photoresist에서의 물의 흡수 연구
이형주,이정환,서주빈,경재선,안일신,Lee, Hyoung-Joo,Lee, Jung-Hwan,Seo, Ju-Bin,Kyoung, Jai-Sun,An, Il-Sin 한국반도체디스플레이기술학회 2006 반도체디스플레이기술학회지 Vol.5 No.2
We employed in-situ spectroscopic ellipsometry(SE) and imaging ellipsometry(IE) to study the interaction of water and photoresist(PR) in 193 immersion lithography. Real time measurement of SE showed thickness increase when PR was immerged in water indicating swelling effect. From the temporal evolution we could observe its reaction-limited behavior. Meanwhile, IE could identify the modification of PR surface by contact of water even for a short period of a second.