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박휘근(Hwi-Keun Park),박세진(Se-Jin Park),최윤서(Yun-Seo Choi),황인환(In-Hwan Hwang),이종찬(Jong-Chan Lee) 한국기계가공학회 2012 한국기계가공학회지 Vol.11 No.2
The resin bonded diamond wheel is used to grind the difficult-to-cut materials. Traditionally, the resin bonded diamond wheel is manufactured without any pores due to the characteristics of resin bond. In this study, two porous resin bonded diamond wheel were made and the grinding characteristics were compared with traditional nonporous ones. The experimental results indicate that the porous resin bond diamond wheel require less grinding forces and powers.